文献类型：期刊文献

英文题名：Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

作者：Huang, Zhengqiang[1];Wu, Wei[1];Drummer, Dietmar[2];Liu, Chao[1];Wang, Yi[1];Wang, Zhengyi[1]

机构：[1]East China Univ Sci & Technol, Sino German Joint Res Ctr Adv Mat, Shanghai 200237, Peoples R China;[2]Friedrich Alexander Univ Erlangen Nuremberg FAU, Inst Polymer Technol, D-91058 Erlangen, Germany

年份：2021

卷号：13

期号：2

起止页码：1

外文期刊名：POLYMERS

收录：;EI(收录号：20210509873007);WOS:【SCI-EXPANDED(收录号:WOS:000611479800001)】；

基金：The work was funded by the Chinese German Centre for the Promotion of Science via the National Natural Science Foundation of China (NSFC) and Deutsche Forschungsgemeinschaft (DFG) under grant number GZ1448.

语种：英文

外文关键词：AgNWs; BN; hybrid filler; thermal conductive; polydimethylsiloxane

摘要：In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m center dot K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.