文献类型：期刊文献

英文题名：Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

作者：Lv, Jinge[1];Zhao, Xuehua[1];Jie, Xu[2,3];Li, Jun[1];Wei, Xiaochuan[1];Chen, Biao[1];Hong, Gang[1];Wu, Wenjun[1];Wang, Limin[1,4]

机构：[1]East China Univ Sci & Technol, Key Lab Adv Mat, Inst Fine Chem, Sch Chem & Mol Engn, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, State Key Lab Chem Engn, Shanghai 200237, Peoples R China;[3]East China Univ Sci & Technol, Sch Chem Engn, Shanghai 200237, Peoples R China;[4]Chinese Acad Sci, Key Lab Organofluorine Chem, Shanghai Inst Organ Chem, 345 Lingling Rd, Shanghai 200032, Peoples R China

年份：2019

卷号：6

期号：13

起止页码：3254

外文期刊名：CHEMELECTROCHEM

收录：;EI(收录号：20192507063659);WOS:【SCI-EXPANDED(收录号:WOS:000475512500004)】；

基金：This research was financially supported by the National Nature Science Foundation of China (21772039, 21272069), and the Fundamental Research Funds for the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences, and we thank the Chinese Scholarship Council for financial support.

语种：英文

外文关键词：copper electrodeposition; fatty acids; leveler; quaternary ammonium surfactant; renewable resources

摘要：A series of fatty acid quaternary ammonium surfactants (FAQAS 1 a-1 f) derived from renewable resource of fatty acid have been rationally designed and investigated as levelers applied in copper electroplating. Surface tension and contact angle indicated the FAQAS's surfactivity and wettability were closely related to the length of hydrophobic chains. FAQAS 1 a-1 f displayed the capability to inhibit the copper deposition in CV tests and their inhibiting abilities agreed with the order of their surfactivity and wettability. Compound 1 e showed the best inhibition capability, and was comprehensively tested by field-emission scanning electron microscopy (FE-SEM), X-ray photoelectron spectroscopy (XPS) and other electrochemical measurements. The strong inhibition ability of compound 1 e on copper electrodeposition could be attributed to its fast and strong absorption of 1 e on the cathode surface. Moreover, galvanostatic measurements (GMs) indicated that compound 1 e not only cause polarization but also has stable synergistic effects with other additives to form a convection dependent competitive adsorption layer. In addition, through-hole (TH) electroplating experiments verified that uniform TH could be obtained on copper electrodeposition using the bath containing compound 1 e. This work may shed some light on the pratical application of surfactants as effective leveler in acid copper electroplating.