文献类型：期刊文献

中文题名：含硅氮芳炔树脂的合成、表征及固化动力学

英文题名：SYNTHESIS,CHARACTERIZATION AND CURING KINETICS OF SILICON-CONTAINING DIPROPARGYL ANILINE RESIN

作者：张昕[1];沈学宁[1]

机构：[1]华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237

年份：2014

卷号：31

期号：5

起止页码：52

中文期刊名：精细石油化工

外文期刊名：Speciality Petrochemicals

收录：CSTPCD;;Scopus;北大核心:【北大核心2011】；CSCD:【CSCD_E2013_2014】；

基金：上海市重点学科资助(B502)

语种：中文

中文关键词：含硅氮芳炔树脂;示差扫描量热法;固化动力学

外文关键词：silicon-containing dipropargyl aniline;differential scanning calorimetry;curing kinetics

摘要：以N,N′-二炔丙基苯胺和二甲基二氯硅烷为聚合单体,通过格式反应合成了含硅氮芳炔树脂,采用FTIR,1 H NMR表征其结构,利用DSC研究了含硅氮芳炔树脂的固化动力学,确定固化反应为一级反应,起始固化温度约为218℃。利用TGA分析了固化树脂的热性能,结果表明:含硅氮芳炔树脂在氮气中Td5为451℃,具有良好的耐热性。
A novel silicon-containing dipropargyl aniline(DPAMS)was synthesized by Grignard reac-tion with dimethyl dichlorosilane and N,N'-dipropargyl-aniline(DPA)as raw materials.The structure was characterized by FT-IR and NMR.Curing kinetics of DPAMS resin was studied by means of differential scanning calorimetry(DSC).Curing reaction was identified as first order reaction with initial curing temperature as about 218℃.The cured resin possessed excellent high temperature-resistance properties with respect to the decomposition temperatures at 5%weight loss(Tds)451℃in N2.