文献类型：期刊文献

中文题名：高热稳定性含硅芳炔树脂的制备及其性能

英文题名：High Thermostability of Silicon-containing Arylacetylene Resin

作者：阮湘政[1];邓诗峰[1];姜欢[1]

机构：[1]特种功能高分子材料及其相关技术教育部重点实验室(华东理工大学),上海200237

年份：2018

卷号：36

期号：4

起止页码：595

中文期刊名：材料科学与工程学报

外文期刊名：Journal of Materials Science and Engineering

收录：CSTPCD;;北大核心:【北大核心2017】；CSCD:【CSCD2017_2018】；

语种：中文

中文关键词：含硅芳炔树脂;乙酰丙酮镍二水合物;炔基化合物;耐高温材料

外文关键词：silicon-containing arylacetylene resin;nickel acetylacetonate dehydrate;alkynyl compound;heat-resistant material

摘要：在含硅芳炔中添加乙酰丙酮镍二水合物(Ni(acac)_2·2H_2O)和炔基化合物N,N,N’,N’-四炔丙基-4,4’-二氨基-二苯甲烷(B4)制备了两种高热稳定性PSA树脂体系,考察添加物用量对体系凝胶时间、固化温度和热稳定性的影响。结果显示:当添加0.2wt%的Ni(acac)_2·2H_2O时,凝胶时间21.2min;峰值固化温度214℃;质量损失5%的热分解温度(T_(d5))为651.1℃;再向其中添加3wt%B4后,凝胶时间缩短到8.5min;峰值固化温度提高到221℃;树脂固化物的热稳定性显著提高。
Two silicon-containing arylacetylene（PSA）resin systems with high thermostablity were prepared by adding nickel acetylacetonate dehydrate（Ni（acac）2·2H2O）and N,N,N＇,N＇-tetrapropargyl-p,p＇-diaminodi-phenyl methane（B4）in the resins.The influence of additive content on gel-time,curing temperature and thermostability of the PSA was investigated.The results showed that addition of 0.2 wt% Ni（acac）2·2H2O in PSA,the gel-time of 21.2 min,peak curing temperature of 214℃ and the temperature of651.1℃ at 5% mass loss（T（d5））were achieved,while further addition of 3 wt% B4,the gel-time,peak curing temperature and Td5 are 8.5 min,221℃,respectively.Thermostability of cured resin is improved obviously.