文献类型：专利

英文题名：High temperature resistant silicon-containing arylalkynyl resin foam material comprises silicon-containing arylalkynyl resin, foaming agent and auxiliary foaming agent

作者：DENG S;DU L;CHENG L;WEI Y;ZHOU Y;DAI D;JIANG X;LI D

机构：[1]UNIV EAST CHINA SCI & TECHNOLOGY

申请号：CN105273364-A

申请日：2014-07-09

公开日：2016-01-27

语种：英文

收录：DERWENT

摘要：NOVELTY - High temperature resistant silicon-containing arylalkynyl resin foam material comprises 100 pts. wt. silicon-containing arylalkynyl resin, 0.5-10 pts. wt. foaming agent and 0.5-10 pts. wt. auxiliary foaming agent. USE - High temperature resistant silicon-containing arylalkynyl resin foam material useful as high temperature ablative material, high temperature wave-transparent materials and high temperature ceramic precursors in the field of electronics, information and aerospace. ADVANTAGE - High temperature resistant silicon-containing arylalkynyl resin foam material has excellent dielectric properties, mechanical properties and high temperature ceramic technology performance, good heat resistance, low thermal conductivity, low water absorption and compressive strength. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparation of high temperature resistant silicon-containing arylalkynyl resin foam material comprising mixing 100 pts. wt. silicon-containing arylalkynyl resin foam material prepolymer, 0.5-10 pts. wt. foaming agent and 0.5-10 pts. wt. auxiliary foaming agent, cooling at 100 degrees C for 0.1-30 minutes, adding molten resin, stirring for 1-5 minutes at 130-250 degrees C, curing for 6-10 hours.