文献类型：期刊文献

英文题名：Highly enhanced thermal conductivity of TPU composites with segregated network constructed by the in-situ reduction of copper

作者：Wang, Yi[1];Chen, Qiming[1];Liu, Chao[1];Li, Shuo[1];Wu, Wei[1]

机构：[1]East China Univ Sci & Technol, Sino German Joint Res Ctr Adv Mat, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

年份：2023

卷号：941

外文期刊名：JOURNAL OF ALLOYS AND COMPOUNDS

收录：;EI(收录号：20230513458017);WOS:【SCI-EXPANDED(收录号:WOS:000924909500001)】；

基金：Acknowledgments The joint research project was funded by the Chinese German Centre for the Promotion of Science via the NSFC and DFG (No. GZ1448) .

语种：英文

外文关键词：Heat conduction; Phonons; Composite materials; Electrical transport

摘要：Cu@TPU composite particles with a structure of TPU core and Cu particles shell were fabricated by in-suite reduction of Cu on the surface of TPU granules. The Cu@TPU composites were then prepared by the hot compression of the as-prepared core-shell particles. The Cu@TPU composite granules were characterized by X-ray photoelectron spectroscopy, X-ray diffraction, thermogravimetric analysis and scanning electron microscopy, which verified that the outer layer of core-shell structure was Cu particles and the connection between Cu and TPU was chemical bonding. The cross-section of Cu@TPU composites showed typical pattern of segregated structure and the surface of those was covered by a layer of Cu particles. With the stacking effect of the special location of Cu and the chemical connection between Cu and TPU, the Cu@TPU composites exhibited a high thermal conductivity of 3.2146 W/m K at 23 vol% filler loading, which was 2.6 times to that of Cu/TPU composites fabricated through simple blending. The TC data of the composites were correlated with Foygel's model. In addition, the dielectric properties and electrical conductivity of the composites were measured. (c) 2023 Elsevier B.V. All rights reserved.