文献类型：期刊文献

英文题名：Amine-Functionalized Reduced Graphene Oxide/Polyimide Nanocomposite as a Material with High Dielectric Constant and Thermal Resistance

作者：Zhang, Pengtu[1,2];Liu, Xiaoyun[1];Zuo, Peiyuan[1];Mi, Puke[1];Zhuang, Qixin[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Adv Polymer Mat Shanghai, Shanghai 200237, Peoples R China;[2]Shandong Inst Petr & Chem Technol, Sch Chem Engn, Dongying 257061, Peoples R China

年份：2023

卷号：6

期号：3

起止页码：1696

外文期刊名：ACS APPLIED NANO MATERIALS

收录：;EI(收录号：20230513475111);WOS:【SCI-EXPANDED(收录号:WOS:000924995800001)】；

基金：This work was financially supported by the National Natural Science Foundation of China (52073091, 51773060, and 2171086) , the Shanghai Pujiang Program (22PJ1402500) , the Natural Science Foundation of Shanghai (20ZR1414600) , the Fundamental Research Funds for the Central Universities (JKD01221701) , the Scientific Development Foundation of Dongying (DY2021016) , and the Key Laboratory of Advanced Polymer Materials of Shanghai.

语种：英文

外文关键词：polymer composites; graphene; polyimide; dielectric properties; thermal properties

摘要：With the development of renewable energy resources, polymer-based dielectric materials, as key components in energy storage devices with optimized dielectric property, high-temperature stability, and good processibility, are highly demanded. In this study, p-phenylenediamine (PPD)-modified and L-ascorbic acid (LAA)-reduced graphene oxide (NH2-CRG) nanosheets with significant chemical functionalization and significantly improved dispersity were prepared. Also, polyimide was chosen to be the polymer matrix due to its high-temperature resistance, chemical inertness, and excellent mechanical property. By incorporating NH2CRG into the PI polymer matrix via in situ polymerization, 0.8 wt % NH2-CRG/PI composite material with a dielectric constant as high as 839 and a breakdown strength of 80 kV center dot mm(-1) was obtained. Meanwhile, the 5 wt % weight loss temperature of 0.8 wt % NH2-CRG/PI witnessed a 17.6 degrees C increase compared to pure PI. This work provided a promising strategy to prepare graphenebased materials for high-dielectric applications and a realizable process of fabricating polymer-based dielectric composite materials.