文献类型：期刊文献

英文题名：Effect of glass phase on solder joint reliability in crystalline silicon photovoltaic modules

作者：Gao, Weichuan[1];Huang, Feihong[1];Tong, Hua[1];Yuan, Shuanglong[1];Chen, Guorong[1];Yang, Yunxia[1]

机构：[1]E China Univ Sci & Technol, Minist Educ, Sch Mat Sci & Engn, Key Lab Ultrafine Mat, Shanghai 200237, Peoples R China

年份：2015

卷号：26

期号：10

起止页码：7811

外文期刊名：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录：;EI(收录号：20152801019846);WOS:【SCI-EXPANDED(收录号:WOS:000361487100067)】；

基金：This study was supported by Shanghai Science and Technology Committee Project (No. 13dz1201103) and Shanghai Pujiang Talent Plan (No. 14PJ1402500).

语种：英文

外文关键词：Reliability - Crystalline materials - Heat storage - Photovoltaic effects - Tin alloys - Silicon - Solar panels - Erosion - Metallizing

摘要：The reliability of solder joints on Ag metallization electrodes is one of important factors that affect the service lifetime of crystalline silicon photovoltaic (PV) modules. In this article we show the effect of glass phase in Ag pastes on solder joint reliability. With peeling test of soldered samples after heat storage at 150 A degrees C for various durations, we observed that with the increase of aging time, the fracture of peeled PV ribbons gradually extended inwards to Ag/Si interface, and there was remarkable distinction in the thermal endurance of solder joints as different glass frits were used in Ag metallization process. This indicates that the erosion of glass phase by solder is primary cause of the aging of solder joints, and this erosion mechanism depends on the glass phase composition. In terms of Bi containing glass that is generally adopted in the most commercial Ag pastes, we found that the Sn/Pb alloy solder can easily reduce Bi cations so as to destroy the glass network structure, making the Ag/Si interconnection to fail.