文献类型：期刊文献

英文题名：Synthesis and characterization of silicon-containing arylacetylene ether of bisphenol a resins and their composites

作者：Zheng, Jiadong[1]; Yuan, Qiaolong[1]; Cui, Fangxu[1]; Huang, Farong[1]

机构：[1] Key Laboratory of Specially Functional Polymeric Materials and Related Technology, Ministry of Education, School of Materials and Engineering, East China University of Science and Technology, 200237, China

年份：2018

卷号：397

期号：1

外文期刊名：IOP Conference Series: Materials Science and Engineering

收录：EI(收录号：20183805838432)

语种：英文

外文关键词：Curing - Heat resistance - Organic solvents - Phenols - Nuclear magnetic resonance - Thermogravimetric analysis - Ethers - Silicon - Reinforcement

摘要：Two novel resins, silicon-containing arylacetylene ether of bisphenol A (PSAP-A) and 1, 3-diethynylbenzene-terminatedsilicon-containing arylacetylene ether of bisphenol A (DPSAP-A), were synthesized from dipropargyl ether of bisphenol A (BADPE) and dimethyldichlorosilane through Grignard reaction. The structures of the resins were characterized by protonnuclearmagnetic resonance(1H-NMR), and thermal properties was explored by thermogravimetric analysis(TGA)and dynamic thermo-mechanical analysis (DMA). In addition, T300 carbon fiber(T300CF) reinforced PSAP-A composite (T300CF/PSAP-A)and T300 carbon fiber reinforced DPSAP-A composite (T300CF/DPSAP-A) were prepared by a solution-impregnation process using tetrahydrofuran as solvent. The results showed that the cured PSAP-A resin and DPSAP-A resin displayed good heat resistance and processing properties. Degradation temperatures of the cured PSPA-A resin and DPSAP-A resin at 5% weight loss (T d5) were 421.5°C and 486.3°C, respectively. The flexural strengths of T300CF/PSAP-A and T300CF/PSAP-Acomposites reached 458.2 MPa and 287.6 MPa, respectively. ? Published under licence by IOP Publishing Ltd.