文献类型：期刊文献

中文题名：基于UV-LIGA技术的双层微齿轮模具镶块工艺

英文题名：Insert Process of the Double-Deck Microgear Mold Based on the UV-LIGA Technology

作者：李燃灯[1];秦宗慧[1];周嘉[2]

机构：[1]华东理工大学机械与动力工程学院,上海200237;[2]复旦大学微电子系,上海200433

年份：2012

卷号：49

期号：2

起止页码：129

中文期刊名：微纳电子技术

外文期刊名：Micronanoelectronic Technology

收录：CSTPCD;;北大核心:【北大核心2011】；

基金：复旦大学专用集成电路与系统国家重点实验室资助项目(10KF006)

语种：中文

中文关键词：UV-LIGA;氧化铟锡(ITO);背面曝光;正面套刻;双层微齿轮;模具镶块

外文关键词：UV-LIGA; indium tin oxidation（ITO）; back exposure; front alignment; double-deck microgear; mold insert

摘要：以氧化铟锡(ITO)玻璃作为基底,采用UV-LIGA技术制作了双层微齿轮型腔模具的镶块。首先,采用正胶(RZJ-304)进行光刻,在ITO玻璃表面电镀镍掩模,通过镍掩模对第一层SU-8光刻胶进行背面曝光。再利用正面套刻的方法对第二层SU-8光刻胶进行曝光,显影得到双层微齿轮的胶模。最后,进行微电铸得到双层微齿轮型腔镶块。通过实验验证了双层微齿轮模具镶块制作的工艺流程,优化了其工艺参数,克服了底部曝光不足引起的问题,并对制作工艺过程中产生的涂胶不平整、前烘时胶层不稳定、热板加热不均以及接触式曝光破坏胶层表面等问题进行了研究。所制得的双层微齿轮胶模垂直度高,表面质量好,且套刻精度高。
UV-LIGA technology was adopted to fabricate the insert of the double-deck microgear mold on the indium tin oxidation（ITO） glass substrate.Firstly,through the photoetching with the positive photoresist（RZJ-304）,the nickel mask was electroplated on the ITO substrate.The first layer photoresist of the SU-8 was exposed from the backside with the nickel mask.Then the second layer photoresist of the SU-8 was exposed by the alignment from the front side.The photoresist mold of the double-deck microgear was obtained after developing.Finally,the mold insert was made by electroplating.The feasibility of the fabrication process flow was confirmed through the experiment,and the technological parameters were optimized.Through utilizing the exposure from the backside and the alignment from the front side,the problems caused by the under exposure of the bottom were resolved.The issues emerging in the fabrication process were studied,such as the uneven coating,instability of the adhesive layer in the prebake,uneven hea-ting of the hot plate and the damage of the adhesive layer caused by the contact-type exposure.The photoresist mold of the double-deck microgear fabricated in the experiment is of high verticality,good surface quality and superior alignment precision.