文献类型：期刊文献

中文题名：含硅氢基团甲基芳炔树脂的合成及表征

英文题名：Synthesis and Characterization of Poly(arylacetylene) Resins Containing Methylsilylene Groups

作者：张玲玲[1];高飞[1];周围[1];张健[1];黄发荣[1];杜磊[1]

机构：[1]华东理工大学特种功能高分子材料及相关技术教育部重点实验室,上海200237

年份：2009

卷号：9

期号：3

起止页码：574

中文期刊名：过程工程学报

外文期刊名：The Chinese Journal of Process Engineering

收录：CSTPCD;;Scopus;北大核心:【北大核心2008】；CSCD:【CSCD2011_2012】；

基金：国家高技术研究发展计划(863)基金资助项目(编号:2002XX305205)

语种：中文

中文关键词：含硅芳炔树脂;含硅氢基团树脂;陶瓷前驱体

外文关键词：silicon-containing poly（arylacetylene） resin; resin with methylsilylene groups; ceramic precursor

摘要：以二氯甲基硅烷和间二乙炔基苯为原料,通过格氏反应合成了不同分子量的含硅氢基团甲基芳炔树脂(PSA-H),并分析确定了合成产物的结构.树脂的热固化行为和固化树脂的热稳定性分析表明,PSA-H树脂具有良好的加工性能,可在较低的温度下(低于200℃)发生交联反应.其固化物有较低的介电常数(2.57F/m)、较低的介电损耗(tanδ0.001)和优异的热稳定性,在N2气氛下5%失重温度Td5为675～703℃,1000℃的残留率为90.9%～91.4%.PSA-H树脂固化物在氩气中1450℃下烧结可形成含β-SiC陶瓷.
A series of poly（arylacetylene） resins containing methylsilylene groups （PSA-H） were synthesized by the condensation reaction between organomagnesium reagents and dichloromethylsilane. The structures of resins were characterized. The curing behavior of PSA-H resins was traced by DSC and thermal stability of the cured resins by TGA. The results showed that the resins were easily processed and cured at temperature lower than 200℃. The cured PSA-H resins possessed low dielectric constant （2.57 F/m）, low dielectric loss （tanδ 0.001） and excellent thermal stabiliy. Td5 （temperature at 5% weight loss） of the cured resins ranged from 675 ℃ to 703 ℃, and the char yields of cured resins at 1000℃ were 90.9%-91.4% under nitrogen. After the cured resins were sintered, β-SiC-containing ceramic was obtained.