文献类型：期刊文献

中文题名：萘乙炔基封端的含硅聚酰亚胺的制备与性能

英文题名：Preparation,Processing and Thermal Properties of Naphthaleneethynyl-terminated Silica-containing Polyimides

作者：夏纪宇[1];姜宁[1];吴凝宇[1];赵兴旺[1];刘雨萌[1];刘西炜[1];扈艳红[1];林嘉平[1]

机构：[1]特种功能高分子材料及相关技术教育部重点实验室、华东理工大学材料科学与工程学院,上海200237

年份：2023

卷号：54

期号：12

起止页码：1826

中文期刊名：高分子学报

外文期刊名：Acta Polymerica Sinica

收录：CSTPCD;;Scopus;WOS:【SCI-EXPANDED(收录号:WOS:001114360300003)】；北大核心:【北大核心2020】；CSCD:【CSCD2023_2024】；

基金：中央高校基本科研业务费专项资金(项目号JKD01231701);上海航天科技创新基金(基金号SAST2019-77)资助项目.

语种：中文

中文关键词：聚酰亚胺;加工性能;热性能;萘环;硅

外文关键词：Polyimide;Processability;Thermal properties;Naphthalenic unit;Silicon

摘要：为了获得兼具良好热性能和加工性能的聚酰亚胺树脂,设计合成了不对称二胺(3-氨基-苯基)-(4'-氨基-苯基)-乙炔(AMPA),含萘环的封端剂3-(萘-1-乙炔基)苯胺(NAA)以及含硅二酐双(3,4-二羧基苯基)二甲基硅烷二酐.为研究结构与性能的关系,引入4,4'-双邻苯二甲酸酐(ODPA)和间氨基苯乙炔(APA)为对照二酐和封端剂,制备了一系列分子链中含硅和内炔基团的聚酰亚胺树脂PI-Si-Ⅰ(以APA为封端剂)和PI-Si-Ⅱ(以NAA为封端剂),以及与之相对照的树脂PI-O-Ⅰ和PI-O-Ⅱ(二酐单体为ODPA).PI-Si树脂在常见溶剂如四氢呋喃中具有很好的溶解度,而PI-Si-Ⅱ树脂更是具有低的熔体黏度和100℃宽的加工窗口.热失重的结果显示固化树脂具有良好的耐热性能,5 wt%热失重温度(Td5)在547℃左右,质量残留率在79%左右;热裂解分析结果表明在聚酰亚胺主链中引入的硅和内炔基团在高温环境中形成硅氧硅结构和苯环等刚性结构,从而提高树脂的耐热性.
Silicone,alkyne and naphthalene groups are introduced into polyimides to obtain novel polyimides with good thermal and processing properties.Asymmetric diamine(3-aminophenyl)-(4'-aminophenyl)-acetylene(AMPA)and 3-(naphthalene-1-acetylene)aniline(NAA)naphthalene rings were synthesized by Sonogashira reaction.Then using AMPA,NAA,bis(3,4-dicarboxyphenyl)dimethylsilane di-anhydride,4,4'-diphthalic anhydride(ODPA)and m-aminobenzene(APA)as raw materials,a series of polyimide resins PI-Si-Ⅰ(APA as the terminating agent)and PI-Si-Ⅱ(NAA as the terminating agent)containing silicon and endoalkynyl groups in molecular chains were prepared with control group PI-O-Ⅰand PI-O-Ⅱ(ODPA as the monomer of dianhydride).The PI-Si resins had high solubility in common solvents such as tetrahydrofuran(THF),low melt viscosity and wide processing window of Pi-Si-Ⅱ resin.The processing window of resin was 100℃.The curing thermal behaviors of the resins were tracked by differential scanning calorimetry(DSC).The results showed that each resin had two curing peaks,the first peak appeared in the range of 285?328℃with the peak temperature at 311℃,and the second peak appeared in the range of 350?422℃with its second peak temperature at 390℃.The thermogravimetric test showed that the T_(d5) of cured resin was 547℃,and the R800℃exceeded 79%,suggesting their excellent heat resistance.The thermal cracking analysis of the cured resins showed that the silico-oxy-silicon structure,benzene ring and naphthalene ring rigid structures were formed when silicomethyl and acetylene groups were introduced into the main polyimide chain at high temperature,which improved the heat resistance of the resin.