文献类型：期刊文献

英文题名：Facile preparation of high-precision flexible circuits through combining inkjet printing and template plating

作者：Li, Qing[1,2];Chen, Yile[1];Ye, Mingxuan[1];Pan, Yi[2];Zhu, Huamiao[2];Tan, Yuxuan[2];Yuan, Shuanglong[2];Fang, Bin[1];Liang, Ying[1];Zhang, Zhen[1]

机构：[1]East China Univ Sci & Technol, Sch Phys, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

年份：2026

卷号：37

期号：24

外文期刊名：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录：;WOS:【SCI-EXPANDED(收录号:WOS:001858303100001)】；

基金：This work was supported by the Undergraduate Training Program on Innovation and Entrepreneurship under Grant No. 202610251123X.

语种：英文

摘要：Driven by the rapid evolution of electronic devices toward multifunctionality and portability, circuits fabricated on flexible substrates require increasingly higher manufacturing precision to support the integration of high-density electronic components. In this work, a facile strategy combining inkjet printing and template plating was proposed to fabricate high-precision flexible circuits. An adhesive layer was first introduced onto the polyimide substrate to enhance interfacial adhesion and substrate compatibility, followed by inkjet printing of a resin solution to form circuit templates. The uniform template with an average line width of 58.5 mu m was obtained by optimizing the printing parameters. The printed template was chemically modified via alkali treatment and Ag activation, which generates catalytically active sites for selective electroless Cu plating. The uniform Cu circuits with an average width of 63.2 mu m were obtained, exhibiting low resistivity of 8.45 mu Omega cm, strong adhesion strength of 5B, and excellent fatigue resistance under cyclic bending. Moreover, the Sn circuit was electroplated based on the Cu circuit template. The precision consistency of the Sn circuits was confirmed by electrical fusing tests according to the corresponding national standard (GB/T 9364.4-2016). The Sn circuit also exhibited strong thermal stability during reflow cycles at 220 degrees C. These results demonstrate the enormous application potential of the proposed strategy for the additive manufacturing of high-precision flexible circuits.