文献类型：期刊文献

中文题名：耐400℃高温氰酸酯导电胶的制备与性能

英文题名：Preparation and Properties of Cyanate Ester Conductive Adhesive Resistant to 400 ℃

作者：孙怡坤[1];朱召贤[2];王涛[2];牛波[1];龙东辉[1]

机构：[1]华东理工大学化工学院,上海200237;[2]中国电子科技集团公司第五十八研究所,江苏无锡214035

年份：2023

卷号：37

期号：5

起止页码：217

中文期刊名：材料导报

外文期刊名：Materials Reports

收录：CSTPCD;;EI(收录号：20231513867551);Scopus;北大核心:【北大核心2020】；CSCD:【CSCD2023_2024】；

基金：国家自然科学基金(22078100,52102098)。

语种：中文

中文关键词：耐高温导电胶;氰酸酯;粘接性能;热物理性能;导电性能

外文关键词：high temperature resistant conductive adhesive;cyanate;bonding property;thermal physical property;electrical conductivity

摘要：为了解决芯片密封封装时管壳高温焊接导致的芯片脱粘、封装内产气等问题,本工作首次以耐高温氰酸酯树脂为基体、高纯片状Ag粉为填料,制备了耐400℃高温的氰酸酯导电胶。微观结构分析结果表明,片状Ag颗粒在氰酸酯基体中随机分布,形成了较好的导热导电网络,且去除Ag粉表面有机物可以有效抑制氰酸酯导电胶粘接固化后气泡和裂纹的产生。热性能分析表明氰酸酯导电胶具有优异的热稳定性,其在300℃下的失重率仅有0.06%,400℃下的失重率小于0.3%,远低于目前公开报道的导电胶在相同温度下的失重率。氰酸酯导电胶的玻璃化温度(Tg)为240℃,低于和高于Tg时的热膨胀系数分别为51.2×10^(-6)/℃和162.2×10^(-6)/℃,具有较宽的使用温度范围。环境实验和力学性能测试表明,氰酸酯导电胶具有优异的粘接性能和环境适应性,330℃固化后的导电胶在环境测试后平均芯片剪切强度高达18.4 MPa。本工作制备的氰酸酯导电胶具备优异的综合性能,对电子封装用高温导电胶的研发和应用具有重要的参考价值。
To restrain the chip debonding and gas production in package caused by high temperature welding during the chip sealing, cyanate ester conductive adhesive(CECA)with high temperature resistance of 400 ℃ was prepared using high purity flake silver powder as filler and cyanate ester resin as matrix. The microstructure analysis results show that Ag flakes were randomly distributed in the cyanate ester matrix, forming a good thermal and electric conductive network, and removing the organic matter on the surface of Ag powders can effectively inhibit the generation of bubbles and cracks, after the CECA was bonded and cured. Thermogravimetric analysis results show that the weight loss rate of the conductive adhesive is only 0.06% at 300 ℃ and less than 0.3% at 400 ℃, which are far lower than the current weight loss rate of conductive adhesive at the same temperature. The results of thermal performance test show that the Tgof conductive adhesive is 240 ℃, and the CTE is 51.2×10^(-6)/℃ below Tgand 162.2×10^(-6)/℃ above Tg. What’s more, the environmental test and mechanical properties test show that the adhesive has strong adhesive strength and environmental adaptability. When the curing temperature is 330 ℃, the average chip shear strength is up to 18.4 MPa. In conclusion, the CECA prepared in this paper has excellent comprehensive properties, which provides an important reference for the development and application of high temperature conductive adhesive.