详细信息
The effect of hBN on the flame retardancy and thermal stability of P-N flame retardant PA6 ( SCI-EXPANDED收录 EI收录)
文献类型:期刊文献
英文题名:The effect of hBN on the flame retardancy and thermal stability of P-N flame retardant PA6
作者:Zhong, Yuhua[1,3];Zhang, Luchong[1];Fischer, Andreas[2];Wang, Liang[1];Drummer, Dietmar[2];Wu, Wei[1]
机构:[1]East China Univ Sci & Technol, Sinogerman Joint Res Ctr Adv Mat, Dept Sch Mat Sci & Engn, Shanghai 200237, Peoples R China;[2]Friedrich Alexander Univ Erlangen Nurnberg FAU, Dept Inst Polymer Technol, Erlangen, Germany;[3]Rifeng Enterprise Grp Co Ltd, Dept Res Ctr, Foshan, Peoples R China
年份:2018
卷号:55
期号:1
起止页码:17
外文期刊名:JOURNAL OF MACROMOLECULAR SCIENCE PART A-PURE AND APPLIED CHEMISTRY
收录:;EI(收录号:20174904493443);WOS:【SCI-EXPANDED(收录号:WOS:000427291900003)】;
基金:The authors would like to thank the China Scholarship Council (CSC) and the German Academic Exchange Service (DAAD) for supporting the international scientific exchange of scientists and work in that paper within PPP-program. Furthermore the support of BASF SE and Clariant AG is greatly acknowledged for supplying plastic and flame retardant.
语种:英文
外文关键词:flame retardancy; thermal conductivity; hexagonal boron nitride; PA6; halogen-free flame retardant
摘要:A novel thermally conductive Polyamide 6 (PA6) with good fire resistance was prepared by introducing a phosphorous-nitrogen flame retardant (FR) and platelet-shaped hexagonal boron nitride (hBN) into the matrix. With high thermal conductivity and good flame retardancy, the material is suitable for applications in electronic and electrical devices. The limiting oxygen index (LOI) changes for various loadings content of FR. However this formulation still does not show an ideal fire resistance, due to the appearance of melt dripping behavior during the UL 94 test. With the extra introduction of 3 vol% and 5 vol% hBN, the melt dripping behavior during the burning process completely disappeared. The hBN also increased the thermal conductivity. Furthermore PA6 compounded with FR and hBN showed a better thermal stability than neat PA6. The morphology of the char residues was investigated by scanning electron microscopy (SEM). The flaky hBN acted as the framework in the char structure and the rigid hBN could effectively break the bubble-shaped char on the surface of the residues which resulted in the enhancement of the strength and compactness of the char.
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