文献类型：期刊文献

英文题名：Foaming mechanisms in ball milling prepared borosilicate glass powder

作者：Yuan, Jiale[1];Chen, Chunyu[1];Li, Ao[1];Jia, Qingchao[1];Wang, Wenzhi[1];Zhang, Liangzhu[1];Lin, Tiesong[2];Zeng, Huidan[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China;[2]Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

年份：2024

卷号：50

期号：22

起止页码：47754

外文期刊名：CERAMICS INTERNATIONAL

收录：;EI(收录号：20243817055342);WOS:【SCI-EXPANDED(收录号:WOS:001338755900001)】；

基金：The authors are very grateful for the financial support of the State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (AWJ-23Z03) and the National Natural Science Foundation of China for Innovative Research Groups (nos. 52072122 and 52272001).

语种：英文

外文关键词：Borosilicate glass; Sintering; Foaming; Ball milling modification

摘要：Thanks to their exceptional thermal and electrical properties, borosilicate glasses are widely used in chip packaging and electronic pastes. Nonetheless, borosilicate glass powders suffer from the phenomenon of foaming and expansion during sintering process, which greatly affects the sintering densities of the powders and poses limitations to their applications. Herein, we explored the foaming mechanism of borosilicate glasses by ball milling. The foaming of borosilicate glass is due to the adsorption of CO2 from the atmosphere by the glass powder during ball milling. The CO2 forms carbonates on the surface of the glass powder and is released during the sintering process, leading to foaming. Additionally, as the specific surface area of the glass powder increases, its corrosion resistance decreases while its foaming strength increases. The foaming strength of the four glass powders, listed in ascending order, is: SrO-B2O3-SiO2, ZnO-B2O3-SiO2, BaO-B2O3-SiO2 and CaO-B2O3-SiO2. Meanwhile, it was found that the foaming strength could be weakened better by ball milling organic modification method. These findings contribute to a deeper understanding of the glass foaming phenomenon. Furthermore, they offer practical strategies to reduce the foaming and optimize the performance of borosilicate glass-based materials in applications of chip packaging and electronic pastes.