文献类型：期刊文献

英文题名：A high-performance silicon-containing arylacetylene resin with conjugated naphthalene rings

作者：Ma, Manping[1];Liu, Xiaotian[1];Li, Chuan[1];Yuan, Qiaolong[1];Huang, Farong[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Specially Funct Mat & Related Technol, Minist Educ, Shanghai, Peoples R China

年份：2022

卷号：34

期号：1

起止页码：24

外文期刊名：HIGH PERFORMANCE POLYMERS

收录：;EI(收录号：20213310773116);WOS:【SCI-EXPANDED(收录号:WOS:000684653100001)】；

基金：The author(s) disclosed receipt of the following financial support for the research, authorship and/or publication of this article: The authors gratefully acknowledge the support of the Fundamental Research Funds for the Central Universities (No. JKD01211611).

语种：英文

外文关键词：Silicon-containing arylacetylene resin; 2; 7-bis(4-ethynylphenoxy) naphthalene; melt processability; heat-resistant polymer; high-performance resin

摘要：2,7-Diphenyloxynaphthalene with large conjugated structure has been introduced into the main chain of silicon-containing arylacetylene resin and then poly(dimethylsilylene-ethynylenephenoxynaphthyloxyphenylene-ethynylene) (m-PPNSA-MM) was synthesized. The m-PPNSA-MM resin shows good solubility and a wide processing window. A stable three-dimensional cross-linking network formed due to thermal crosslinking reactions of acetylene groups and intermolecular pi-pi stacking interactions after m-PPNSA-MM was cured through the process of 180 degrees C/2 h + 220 degrees C/2 h + 260 degrees C/4 h. The flexural strength and modulus of the cured m-PPNSA-MM resin at room temperature are 49.2 MPa and 2.75 GPa, respectively. The cured m-PPNSA-MM resin show high thermal stabilities, the 5% temperature of weight loss (T-d5) reaches 560 degrees C in nitrogen.