文献类型：期刊文献

英文题名：Thermal management of an integrating air-liquid cold plate driven by negative pressure difference: influence of fan morphology

作者：Bie, Yuzhen[1];Zhang, Tengteng[2];Wang, Ning[3];Shao, Xiang[1];Xu, Hongtao[1]

机构：[1]Univ Shanghai Sci & Technol, Sch Energy & Power Engn, Shanghai 200093, Peoples R China;[2]Suzhou Thermal Win Energy Technol Co Ltd, Suzhou 205300, Peoples R China;[3]East China Univ Sci & Technol, Sch Mech & Power Engn, Shanghai 200237, Peoples R China

年份：2026

卷号：301

外文期刊名：APPLIED THERMAL ENGINEERING

收录：;EI(收录号：20262220826187);WOS:【SCI-EXPANDED(收录号:WOS:001787627200001)】；

基金：This work was supported by the Fundamental Research Funds for the Central Universities (No. JKG01251562) .

语种：英文

外文关键词：Air-liquid coupled cooling; Cold plate; Negative pressure conditions; Thermal management; Fan morphology

摘要：Developing the ultra-high-power chip is of great importance for next-generation data center and artificial intelligence (AI) model training. Thereby the chip damage and economic losses caused by insufficient thermal management and coolant leakage are becoming increasingly unacceptable. Different from conventional cooling methods solely focusing on air or liquid cooling under positive pressure conditions, an innovative integrating airliquid cold plate under negative pressure conditions is proposed and numerically investigated in this study. The impacts of fan morphology, configurations and air supply modes on thermal and flow characteristics of cold plate are systematically discussed. The results indicate that different from constant air inlet boundary conditions model, considering fan morphology induces the complicated vortex at fan zones, resulting in severe airflow nonuniformity, whereas the chip temperature is decreased from 345.2 to 343.5 K owing to more air flowing into fins. As the increase of fan number from 0 to 5, the chip temperature decreases from 345.5 to 339.9 K and corresponding heat dissipation proportion is significantly improved from 1.36% to 24.04%. Compared with blowing mode, the suction mode performs better temperature and flow uniformity at a cost of increment of chip temperature. Under fault scenario, it is recommended that the maximal chip power decreases to 35%, 25% and 20% of thermal design power (TDP) at three, two and one fan configuration, respectively. This study proposes a high security and reliability integrating air-liquid cold plate for chips thermal management and damage protection.