文献类型：期刊文献

中文题名：RTM用含硅芳炔树脂的流变特性与固化反应动力学

英文题名：CHEMORHEOLOGICAL BEHAVIOR AND CURE KINETICS OF SILICON-RYLACETYLENE-CONTAINING RESIN FOR RESIN TRANSFER MOLDING

作者：齐会民[1];王春兰[1];高金淼[1];黄发荣[1];杜磊[1]

机构：[1]华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237

年份：2009

期号：6

起止页码：62

中文期刊名：玻璃钢／复合材料

外文期刊名：Fiber Reinforced Plastics/Composites

收录：CSTPCD;;CSCD:【CSCD_E2011_2012】；

语种：中文

中文关键词：含硅芳炔;RTM成型;化学流变;固化动力学

外文关键词：silicon-arylacetylene-containing resin; resin transfer molding; chemorheology; cure kinetics

摘要：含硅芳炔树脂(PSA-R)具有优异的耐高温、优良的介电性能、高温力学性能,以及优异的工艺性能,适用于RTM成型工艺,广泛应用于航空航天、电子信息领域。本文采用动态差示扫描量热法(DSC)研究了含硅芳炔树脂的固化反应,试验表明含硅芳炔树脂的固化动力学符合n-级固化反应模型,固化反应级数约为2级,反应活化能为110kJ·mol-1。用平板流变仪研究了PSA-R树脂的动态粘度及等温粘度变化,研究了凝胶时间与温度的关系,建立了凝胶模型,根据双Arrhenius方程,建立了含硅芳炔树脂的粘度模型,该模型预测粘度与实验结果相吻合。
Silicon-arylacetylene-containing resin （PSA-R） is applied in aerospace and electrical industries, which is suitable for resin transfer molding with high-temperature resistant, excellent dielectric constant, high-temperature mechanical property and processability. The cure kinetics of PSA-R resin was analyzed by using dynamic differential scanning calorimetry（ DSC）, and it was found that the cure of PSA-R resin followed an nth-order reaction mechanism. The reaction order was nearly two with activation energy of 110kJ· mol^-1. The chemorheological behavior of PSA-R resin was studied with parallel plate viscosity spectrometer. A rheological mode based on the dual- Arrhenius equation was estabilished and used to simulate the rheological behavior of PSA-R resin. The model prediction determined from the dual-Arrhenius equation was in good agreement with experimental data.