文献类型：期刊文献

英文题名：Controllable fabrication of Sn-Bi alloy microspheres for improved lead-free solder

作者：Zhang, Zhen[1];Li, Ping[1];Tang, Qize[1];Liang, Ying[1];Wei, Yuhang[1];Fan, Shichang[1];Yang, Xiangmin[1];Fang, Bin[1]

机构：[1]East China Univ Sci & Technol, Sch Phys, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2023

卷号：308

外文期刊名：MATERIALS CHEMISTRY AND PHYSICS

收录：;EI(收录号：20233214510531);WOS:【SCI-EXPANDED(收录号:WOS:001059485000001)】；

基金：The authors thank Research Center of Analysis and Test, 985 test platform of School of Chemical Engineering of East China University of Science and Technology for the technique support. This work was supported by the Undergraduate Training Program on Innovation and Entrepreneurship under Grant No. S202210251103.

语种：英文

外文关键词：Sn -Bi alloy microspheres; Lead-free solder; High -temperature stability; Ripening and growing

摘要：A ripening and growing method of Sn and Bi nanoseeds mixture was developed to synthesize the Sn-Bi alloy microspheres (Sn-Bi MSs) with adjustable diameter. Which played a vital role in bonding the Cu and Sn MSs fillers of ternary composite solder. Through careful investigations of the relationship between soldering per-formances and the proportion of different filler, the optimal conductivity (& rho; = 19.0 & mu;& omega; cm), bending strength (162.0 MPa) and peeling strength (9.8 N cm-1) were obtained. Meanwhile, the work temperature has been raised about 130 degrees C by the transform of low-melting Sn-Bi to high-melting intermetallic compounds (IMCs) during soldering process. The balance mechanisms of soldering quality and fillers properties have been unraveled and validated. This work suggests a new pathway toward the improvements of performance and high-temperature stability of lead-free Sn-Bi solder, which could be widely applied in the microelectronic and semiconductor packaging.