文献类型：期刊文献

中文题名：Novel thermal interface materials based on mesocarbon microbeads with a high through-plane thermal conductivity

英文题名：新型高面外热导率的中间相炭微球基热界面材料

作者：SUN Zhi-peng[1];MA Cheng[1];WANG Ji-tong[1];QIAO Wen-ming[1];LING Li-cheng[1]

机构：[1]State Key Laboratory of Chemical Engineering,East China University of Science and Technology,Shanghai 200237,China

年份：2025

卷号：40

期号：2

起止页码：440

中文期刊名：新型炭材料(中英文)

外文期刊名：New Carbon Materials

收录：;北大核心:【北大核心2023】；

基金：国家自然科学基金(22178107,U21A2060,22178116,21978097).

语种：英文

中文关键词：Thermal interface material;Mesocarbon microbeads;Through-plane thermal conductivity

外文关键词：热界面材料;中间相炭微球;面外热导率

摘要：The rapid development of the information era has led to in-creased power consumption,which generates more heat.This requires more efficient thermal management systems,with the most direct ap-proach being the development of su-perior thermal interface materials(TIMs).Mesocarbon microbeads(MCMBs)have several desirable properties for this purpose,includ-ing high thermal conductivity and excellent thermal stability.Although their thermal conductivity(K)may not be exceptional among all carbon materials,their ease of production and low cost make them ideal filler materials for developing a new generation of carbon-based TIMs.We report the fabrication of high-performance TIMs by incorporating MCMBs in a polyimide(PI)framework,producing highly graphitized PI/MCMB(PM)foams and anisotropic polydimethylsiloxane/PM(PDMS/PM)composites with a high thermal conductivity using directional freezing and high-temperature thermal annealing.The resulting materials had a high through-plane(TP)K of 15.926 W·m^(?1)·K^(?1),4.83 times that of conventional thermally conductive silicone pads and 88.5 times higher than that of pure PDMS.The composites had excellent mechanical properties and thermal stability,meeting the de-mands of modern electronic products for integration,multi-functionality,and miniaturization.
随着信息时代的飞速发展,电子设备不断更新换代的同时也导致功耗增加产生过多热量问题。解决这一问题需要更高效的热管理系统,其中最直接的途径是开发性能优异的热界面材料(TIMs)。中间相炭微球(MCMB)具有多种理想特性,包括高热导率和优异的热稳定性。尽管其热导率(K)在所有炭材料中并非最突出,但其成熟的加工工艺和低廉的成本使其成为开发新一代碳基TIMs的理想填料。然而,目前基于MCMB的导热复合材料在TIM领域的研究仍然有限,亟需开展新的研究工作。本研究通过将MCMB引入聚酰亚胺(PI)骨架中而成功制备了高性能TIMs,通过定向冷冻和高温热退火技术,获得了高度石墨化的PI/MCMB(PM)泡沫以及具有增强导热性能的各向异性聚二甲基硅氧烷/PM(PDMS/PM)复合材料。所得PDMS/PM复合材料的面外热导率(TP K)高达15.926W·m^(-1)·K^(-1),是传统导热硅胶垫热导率的4.83倍和纯PDMS热导率的88.5倍。此外,该复合材料还展现出优异的力学性能和热稳定性,满足了现代电子产品集成化、多功能化和小型化的需求。本研究提出了一种具有广阔应用前景的新型低成本碳基TIM。