详细信息

铜磷钨玻璃的热、电特性和铜离子的迁移研究    

Thermal and Electric Characteristics of Ionic Migration in Copper-Phosphorus-Tungsten Glass

文献类型:期刊文献

中文题名:铜磷钨玻璃的热、电特性和铜离子的迁移研究

英文题名:Thermal and Electric Characteristics of Ionic Migration in Copper-Phosphorus-Tungsten Glass

作者:王秀芳[1,2];李光远[1,2];徐雷[1,2];柳絮[1,2];朱元泰[1,2];姜建华[1,2];李肖青[1,2]

机构:[1]华东化工学院物理系;[2]华东化工学院无机材料系

年份:1992

卷号:11

期号:5

起止页码:31

中文期刊名:硅酸盐通报

外文期刊名:Bulletin of the Chinese Ceramic Society

收录:CSTPCD;;北大核心:【北大核心1992】;CSCD:【CSCD2011_2012】;

语种:中文

中文关键词:铜;磷;钨;玻璃;性能;离子

外文关键词:glass forming region;;Cu^+ion conducting glasses;;tungstate glass;;AES;;A.C. conductivity;;dielectric response

摘要:确定了30CuI-70(Cu_2O-P_2O_5-WO_3)系统的玻璃形成区,测量了玻璃转变湿度T_(?)、红外和电导率随温度和成份的变化.电导率随CuI和WO_3含量的增加而增加,在室温下对于30CuI-30Cu_2O-20P_2O_5-20WO_3样品的最高电导率值是2.1×10^(-3)Scm^(-1).在此四元系中,电导率的增大用IR、T_(?)和玻璃结构等方面进行了讨论.本文也对玻璃的交流电导率分析和介电响应等进行了描述,用AES方法观察了铜离子的迁移现象.俄歇峰的相对强度给出了铜离子的沉积量.
Glass forming region in 30Cul-70(Cu_2O-P_2O_5-WO_3) system has becn established. T_(?), IR and conductivity dependance on temperature and composition have been measured. The conductivity increased with the increase of CuI and WO_3 contents. A. high ionic conductivity value 2.1×10^(-3) Scm^(-1) at room temperature has been found for the composition 30 CuI-30Cu_2O-20P_2P_-20WO_3. Conductivity eshancement observed in this quatemary system is discussed with reference to IR ,T_(?) and structural aspects. A C. conductivity analysis and dielectric response of these glasses are described. AES was used te investigate the Cu^+ion migration. Auger peak intensity gives out the amount of Cu^+ion accumulation.

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