详细信息
TEAS-DAIE树脂基玻璃纤维复合材料性能的研究
Property of Glass Fiber Reinforced Composite Using TEAS-DAIE Resin as Matrix
文献类型:期刊文献
中文题名:TEAS-DAIE树脂基玻璃纤维复合材料性能的研究
英文题名:Property of Glass Fiber Reinforced Composite Using TEAS-DAIE Resin as Matrix
作者:卜军[1];宋宁[1];倪礼忠[1]
机构:[1]华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237
年份:2012
卷号:38
期号:3
起止页码:307
中文期刊名:华东理工大学学报(自然科学版)
外文期刊名:Journal of East China University of Science and Technology
收录:CSTPCD;;Scopus;北大核心:【北大核心2011】;CSCD:【CSCD2011_2012】;
语种:中文
中文关键词:四(3-乙炔苯胺)基硅烷;固化;复合材料;耐热性
外文关键词:tetra (3-ethylphenyl-amino)-silanes ; curing; composites; heat resistance
摘要:四(3-乙炔苯胺)基硅烷(TEAS)具有合成简单、溶解性好、固化温度低且固化后耐热性好等优异的性能,但以其作为基体树脂制得的玻璃纤维增强复合材料的力学性能较低。将双(N-间乙炔基苯基邻苯二甲酰亚胺)醚(DAIE)与四(3-乙炔苯胺)基硅烷(TEAS)以适当的比例混合,制得复合材料基体树脂,即TEAS-DAIE。用TEAS-DAIE与玻璃纤维复合制得复合材料,并研究了该复合材料的耐热性、力学性能、介电性能、吸水性、断面形貌等。结果表明:复合材料具有优良的力学性能,其在常温下的弯曲强度为385.7 MPa,240℃下的弯曲强度达到373.1 MPa,保留率为96.7%,玻璃化转变温度362.5℃;复合材料具有优良的耐水性能和介电性能,常温下材料在水中浸泡96 h,其吸水率为1.06%,介电常数(ε)为3.95,介电损耗角正切值(tanδ)为5.73×10^(-3)。
Tetra (3-ethylphenyl-amino)-silanes (TEAS) has good performances such as simple process of synthesis, good solubility, low curing temperature and good heat resistance etc, hut the mechanical strength of its composite reinforced with glass fiber is low. Di [-(N-m-acetenylphenyl) phthalimide] ether (DAIE) was used to mix with tetra (3-ethylphenyl-amino)-silanes (TEAS) with proper ratio, and the obtained resin (TEAS-DAIE) was used as the matrix resin of composite. The heat resistance, mechanical strength, dielectric property, water ad.sorption and the fracture surface of the composite were studied. The results showed that the mechanical property of the composite is very good. The flexural strength of the composite was 385.7 MPa at room temperature, while decreased to 373.1 MPa at 240℃ with a retention ratio of 96.7%. Its glass transition temperature is up to 362.5℃. The water resistance and the dielectric property of the composite were also very good. After soaking the composite in water at room temperature for 96 h, the water adsorption ratio was only 1.06%, the dielectric constant was 3.95, and the tangent for the dielectric loss angle was 5.73× 10 3.
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