文献类型：专利

英文题名：High-strength heat-reversible poly-triazole adhesive useful in high bond strength repeat bonding and adjustable bonding

作者：TANG Y;HUANG F;YUAN Q;WAN L

机构：[1]UNIV EAST CHINA SCI & TECHNOLOGY

申请号：CN107201211-A

申请日：2017-06-16

公开日：2017-09-26

语种：英文

收录：DERWENT

摘要：NOVELTY - High-strength heat-reversible poly-triazole adhesive is claimed. The adhesive is prepared from polytriazole polymer (I). USE - The adhesive is useful in high bond strength repeat bonding and adjustable bonding. ADVANTAGE - The adhesive has high initial adhesive strength, excellent reversible adhesiveness, simple construction process and excellent storage stability. DETAILED DESCRIPTION - High-strength heat-reversible poly-triazole adhesive is claimed. The adhesive is prepared from polytriazole polymer of formula (I). A1 = benzene-1, 4-diyl, benzene-1, 3-diyl, (1,4-phenylenebis(oxy))dimethanyl, (1,3-phenylenebis(oxy))dimethanyl, (4,4'-(propane-2,2-diyl)bis(4,1-phenylene))bis(oxy)dimethanyl or (2,2'-(1,4-phenylenebis(oxy))bis(ethane-2,1-diyl))bis(oxy)dimethanyl; A2 = 1,4-phenylenedimethanyl, 1,3-phenylenedimethanyl, biphenyl-4,4'-diyldimethanyl or diphenylmethane-4,4'-diyl; M = ethane-1,2-diyl, hexane-1,6-diyl, decane-1,10-diyl, 1,4-phenylenedimethanyl or 1,3-phenylenedimethanyl; X = Cl, Br or I; and n = 2-60. INDEPENDENT CLAIMS are also included for: (1) preparing high-strength heat-reversible poly-triazole adhesive comprising (i) adding diacetylenic monomer, diazide monomer and dihalide cross-linking agent into organic solvent, stirring and mixing, raising temperature to 60-140 degrees C, continue stirring for 1-24 hours to obtain polytriazole prepolymer solution, and (ii) coating (I) on a substrate, incubating at 50-100 degrees C for 1-5 hours, then heating at 120-180 degrees C, insulating for 1-8 hours, cooling to room temperature, then immersing substrate immersed in deionized water, soaking for 6-48 hours so that film from the substrate automatically, and peeling; and (2) use of high-strength heat-reversible poly-triazole adhesive comprising when adhesive is polytriazole film prepared by (I), sandwiching poly-triazole film between two materials to be bonded under the pressure of 0.5-1.5 MPa at environment 150-200 degrees C for 0.5-4 hours, bonding two materials together, gluing excellent adhesive joints at 100-200 degrees C for 5-60 minutes, separately bonding micro-force two materials, then assembling two separate pieces of material to be bonded, reacting at 80-200 degrees C for 1-48 hours, bonding two separate pieces of material together again in order to repeat the bonding-de-bonding process, when the adhesive is polytriazole liquid adhesive prepared by (I), coating poly triazole liquid adhesive on the surface of the two materials to be bonded, where thickness is 0.2-2 mm, processing temperature is 80-200 degrees C, processing time is 1-48 hours, the two materials to be bonded together, gluing excellent adhesive joints at 100-200 degrees C for 5-60 minutes, separately bonding micro-force two materials, then assembling two separate pieces of material to be bonded, reacting at 80-200 degrees C for 1-48 hours, again bonding two separate pieces of material together, then repeat bonding-de-bonding process.