详细信息

Fine-structured CoCrFeNiMn high-entropy alloy matrix composite with 12 wt% TiN particle reinforcements via selective laser melting assisted additive manufacturing  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:Fine-structured CoCrFeNiMn high-entropy alloy matrix composite with 12 wt% TiN particle reinforcements via selective laser melting assisted additive manufacturing

作者:Li, Bo[1,2];Qian, Bo[1];Xu, Yi[3];Liu, Zhiyuan[1];Xuan, Fuzhen[2]

机构:[1]East China Univ Sci & Technol, Sch Mech & Power Engn, Addit Mfg & Intelligent Equipment Res Inst, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Minist Educ, Key Lab Pressure Syst & Safety, Shanghai 200237, Peoples R China;[3]Univ Calif Berkeley, Dept Mat Sci & Engn, Berkeley, CA 94720 USA

年份:2019

卷号:252

起止页码:88

外文期刊名:MATERIALS LETTERS

收录:;EI(收录号:20192206993998);WOS:【SCI-EXPANDED(收录号:WOS:000474721300024)】;

基金:The work is support by National Natural Science Foundation of China (No. 51505293) and Natural Science Foundation of Jiangsu Province in China (No. BK20160407).

语种:英文

外文关键词:Selective laser melting; High-entropy alloy; Additive manufacturing; Composite materials; Microstructure

摘要:Selective Laser Melting (SLM) was employed for Additive Manufacturing (AM) of nearly equiatomic CoCrFeNiMn high-entropy alloy (HEA) and its matrix composite parts reinforced by 12 wt% nano-sized TiN particles (TiNP). HEA matrix microstructure of printed TiNP/HEA was remarkably refined and isotropic, rather than anisotropic coarse-grains of printed HEA in absence of TiNP. The ceramic reinforcements achieved a relatively uniform distribution in HEA matrix to contribute to the pinning effects for strengthening. High specific strength and good sliding-wear resistance of printed TiNP/HEA were achieved. The as-printed Gyroid architecture of TiNP/HEA exerted an elevated compression-resistance. The introduced TiNP, as a large number of nanoscale nucleation sites during SLM, benefits the formation of nearly equiaxed and ultrafine grains of HEA matrix for strengthening. (C) 2019 Elsevier B.V. All rights reserved.

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