文献类型：期刊文献

英文题名：Basic experimental investigation of pulsed electrochemical mechanical polishing process

作者：Yi, J. J.[1];Chen, C. M.[1];Tian, X. Q.[1];Ji, B. Y.[2]

机构：[1]E China Univ Sci & Technol, Dept Mech Engn, Shanghai 200237, Peoples R China;[2]Sunyard Syst Engn Co Ltd, Hangzhou 310053, Zhejiang, Peoples R China

年份：2009

卷号：25

期号：7

起止页码：535

外文期刊名：SURFACE ENGINEERING

收录：;EI(收录号：20093412262951);WOS:【SCI-EXPANDED(收录号:WOS:000267710800009)】；

基金：The authors gratefully acknowledge the support of the Nature Science Fund of China (NSFC) (grant no. 5955033).

语种：英文

外文关键词：Pulse electrochemical mechanical polishing; ECMP; Surface quality; Productivity

摘要：Pulse electrochemical mechanical polishing (PECMP) technology is a compound polishing technology by combining the mechanical action of a traditional grinding process and the electrochemical reaction of a pulse electrochemical machining (PECM) like process. Its advantages are low surface roughness, high efficiency, simple equipment, low material removal and more applications. Because a number of processing input variables (voltage activation program, electrolyte composition, etc.) will influence the surface quality of workpiece and productivity, controlling the surface reactions in PECMP requires a carefully designed combination of various processing parameters. In the present work, several typical experiments are investigated to compare the properties of PECMP with that of electrochemical mechanical polishing (ECMP). The experimental results can contribute to optimisation of the processing parameters of PECMP. Analytic methodology for the workpiece surface quality after PECMP is helpful to conduct the processing parameters as well. By comparison, PECMP is proved to be more efficient and have better surface quality than ECMP.