文献类型：期刊文献

英文题名：Preparation and properties of silicon-containing arylacetylene resins with octa(maleimidophenyl)silsesquioxane

作者：Zhou, Yan[1]; Huang, Fuwei[1]; Huang, Farong[1]; Du, Lei[1]

机构：[1] Key Laboratory of Specially Functional Polymeric Materials and Related Technology, School of Materials Science and Engineering, Ministry of Education, East China University of Science and Technology, Shanghai 200237, China

年份：2012

卷号：557-559

起止页码：1152

外文期刊名：Advanced Materials Research

收录：EI(收录号：20124215567906)

语种：英文

外文关键词：Dielectric properties - Silicon - Curing - Resins

摘要：Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)- silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins. ? (2012) Trans Tech Publications, Switzerland.