详细信息

Multiwalled Expanded Graphite Coated with Nanometer-Thick Silica Layers for Thermal Management  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:Multiwalled Expanded Graphite Coated with Nanometer-Thick Silica Layers for Thermal Management

作者:Liu, Xingrong[1];Wu, Wei[1,2];Liu, Chao[1];Wang, Yi[1];Wang, Yichen[1];Chen, Qiming[1];Cui, Sufei[1]

机构:[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Sino German Joint Res Ctr Adv Mat, Shanghai 200237, Peoples R China;[2]Shenzhen Res Inst ECUST, Shenzhen 518063, Peoples R China

年份:2022

卷号:5

期号:6

起止页码:7858

外文期刊名:ACS APPLIED NANO MATERIALS

收录:;EI(收录号:20222712324472);WOS:【SCI-EXPANDED(收录号:WOS:000818104600001)】;

基金:This study was funded by National Government Guided Special Funds for Local Science and Technology Development (Shenzhen, China) (No. 2021Szvup041).

语种:英文

外文关键词:polymer-matrix composites; thermal and electrical properties; nanolayer; electron microscopy

摘要:Thermal management materials utilized in electronic devices are vital components of both future electronics such as flexible electronics and technologies including artificial intelligence. In this work, nanosilica-coated multiwalled expanded graphite (EG-SiO2) is synthesized via a solgel method and subsequently incorporated into the VMQ matrix. The less stiff nanosilica intermediate shell on the EG alleviates the modulus mismatch between the EG and VMQ and improves their interaction. Consequently, the thermal conductivity of the EG-SiO2-VMQ composites is increased by 394% (0.89 Wm(-1) K-1) and 705% (1.45 Wm(-1) K-1) compared to pure VMQ (0.18 Wm(-1) K-1) at low filler loadings of 5 and 10 wt%, respectively. In addition, the composites have intermediate insulation properties (10(12) Omega.cm ) This is because the SiO2 nanolayer on the EG surface can inhibit electron transfer in the composites and act as an interception point for the conductive path. This work demonstrates that EG-SiO2-VMQ has enormous potential for use in fabricating polymer composites with high thermal conductivity and outstanding insolation capability, which can be utilized in aerospace, telecommunications, and mobile electronic devices.

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