文献类型：期刊文献

英文题名：Seed-mediated growth for aspect-ratio-tunable copper nanoplates

作者：Zhou, Yu[1,2];Liang, Ying[1];Fang, Bin[1];Yuan, Shuanglong[2];Zhang, Zhen[1]

机构：[1]East China Univ Sci & Technol, Sch Phys, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

年份：2026

卷号：28

期号：1

起止页码：197

外文期刊名：CRYSTENGCOMM

收录：;EI(收录号：20254919630540);WOS:【SCI-EXPANDED(收录号:WOS:001628655900001)】；

基金：We acknowledge the Open Sharing Service Platform for Instruments and Equipment of East China University of Science and Technology for the technical support.

语种：英文

外文关键词：Adhesives - Copper - Microelectronics - Nanostructures - Packaging materials - Silver - Sintering - Temperature

摘要：Copper materials with nanoplate structure combine the advantages of nano and micrometer dimensions, featuring excellent electrical conductivity, low-temperature sintering performance, and processability. They have considerable applicability and greater economic benefits compared with silver, and thus have attracted much attention in the field of microelectronic packaging. In this study, a seed-mediated growth method was proposed to synthesize copper nanoplates (Cu NPs) under mild conditions. By selecting pre-synthesized silver nanoplates as seeds, the synthetic efficiency and dimensional controllability of Cu NPs have been greatly improved. At 40 degrees C, Cu NPs with good dispersion can be obtained within 15 min. The formation mechanism of Cu NPs was proposed by studying the factors that influence it. The conductive adhesives formulated with as-synthesized Cu NPs achieve an impressively low resistivity of 35 mu Omega cm at a filler content of 90 wt%, paving the way for the industrial application of copper-based conductive adhesives.