详细信息
端乙炔基聚醚酰亚胺改性含硅芳炔树脂的性能
Properties of a Silicon-Containing Arylacetylene Resin Modified with an Acetylene-Terminated Polyetherimide
文献类型:期刊文献
中文题名:端乙炔基聚醚酰亚胺改性含硅芳炔树脂的性能
英文题名:Properties of a Silicon-Containing Arylacetylene Resin Modified with an Acetylene-Terminated Polyetherimide
作者:李晓杰[1];陈会高[1];袁荞龙[1];黄发荣[1]
机构:[1]华东理工大学特种功能高分子材料及相关技术教育部重点实验室,上海200237
年份:2015
卷号:44
期号:9
起止页码:1115
中文期刊名:石油化工
外文期刊名:Petrochemical Technology
收录:CSTPCD;;Scopus;北大核心:【北大核心2014】;CSCD:【CSCD2015_2016】;
语种:中文
中文关键词:含硅芳炔树脂;聚醚酰亚胺;高性能树脂;复合材料
外文关键词:silicon-containing arylacetylene resin; acetylene-terminated polyetherimide; highperformance resin; composite
摘要:合成了具有高反应活性的端乙炔基聚醚酰亚胺(BPAEI-apa),将BPAEI-apa与含硅芳炔树脂(PSA)树脂共混得到PSA-BPAEI-apa改性树脂,再利用模压成型工艺制备了T300碳纤维平纹布增强的PSA-BPAEI-apa改性树脂复合材料(简称增强复合材料)。利用FTIR,1H NMR,DSC,DMA,TGA等方法分析了改性树脂及增强复合材料的结构及性能。表征结果显示,PSA-BPAEI-apa改性树脂既保留了PSA高活性的炔基,又引入了极性酰亚胺结构,具有良好的加工性能,可采用的固化工艺为:170℃,2 h;210℃,2 h;250℃,4 h,在此固化工艺下PSA-BPAEI-apa改性树脂的固化趋于完全,所得到的固化物耐热性能优良,且热稳定性较高。增强复合材料的力学性能优异,常温下弯曲强度为408 MPa左右,层间剪切强度为25 MPa左右。
Highly reactive acetylene-terminated polyetherimide (BPAEI-apa) was synthesized and then a modified resin (PSA-BPAEI-apa) was prepared by blending BPAEI-apa and siliconcontaining arylacetylene resin(PSA). T300 carbon fiber cloth reinforced modified resin PSA-BPAEI- apa composite(reinforced composite) was manufactured by compression molding. The structures and properties of the modified resin and the reinforced composite were investigated by means of ^1H NMR, FTIR, DSC, DMA and TGA. The results showed that the modified resin kept the highly reactive alkynyls of PSA, and polar imide structure was introduced. The modified resin has good processability and the curing process is 170 ℃ for 2 h, 210 ℃ for 2 h and 250℃ for 4 h. The cured modified resin has excellent heat resistance. The reinforced composite has excellent mechanical properties. Its flexural strength and interlaminar shear strength at room temperature reached 408 MPa and 25 MPa, respectively.
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