文献类型：期刊文献

英文题名：Innovative two-step method for efficient silicon microfluidic device fabrication: Integrating laser ablation with wet etching

作者：Wang, Haobo[1];Tong, Hua[1];Liu, Cui[1];Yuan, Xiao[1];Ye, Xiaojun[1];Xiong, Shenghu[1];Xu, Jiahui[1];Li, Hongbo[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

年份：2024

卷号：174

外文期刊名：MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

收录：;EI(收录号：20240815596706);WOS:【SCI-EXPANDED(收录号:WOS:001198918600001)】；

语种：英文

外文关键词：Microchannels; Laser ablation; Wet etching; Silicon

摘要：Silicon microfluidic devices find wide-ranging applications, but their rapid and cost-effective fabrication poses a significant challenge. This paper presents a two-step approach to creating rectangular section microchannels on silicon wafers. Firstly, a pattern of microchannels is directly inscribed onto the silicon wafer using laser ablation, with a SiNx mask, leaving a specific depth of ablated region. Subsequently, anisotropic chemical wet etching is employed to eliminate the ablated zone and fashion rectangular section microchannels along the <100> orientation of the silicon wafer. An aspect ratio of 0.74 can be achieved for the microchannels, and as an illustrative example, a multi-flux microreactor with rectangular section microchannels is manufactured. The investigation investigates and optimized the parameters of laser ablation and wet etching. The depth of laser ablation is primarily regulated by laser power, and increasing the ablation depth enhances the depth of microchannels. The XPS and XRD results shows the presence of Si-O structures and silicon planes (200) and (311) following laser inscription can be considered factors contributing to the increasing of the aspect ratio after etching.