文献类型：期刊文献

英文题名：3D Expanded Graphite Frameworks for Dual-Functional Polymer Composites with Exceptional Thermal Conductive and Electromagnetic Interference Shielding Capabilities

作者：Liu, Chao[1];Wu, Wei[1,2];Chen, Qiming[1];Wang, Yi[1];Cui, Sufei[1];Yang, Hong[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Sino German Joint Res Ctr Adv Mat, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Shenzhen Res Inst, Shenzhen 518063, Peoples R China

年份：2022

卷号：4

期号：2

起止页码：707

外文期刊名：ACS APPLIED ELECTRONIC MATERIALS

收录：;EI(收录号：20220611602489);WOS:【SCI-EXPANDED(收录号:WOS:000766245800018)】；

基金：This work was funded by the National Government Guided Special Funds for Local Science and Technology Development (Shenzhen, China) (No. 2021Szvup041).

语种：英文

外文关键词：3D framework; expanded graphite; graphene; thermal conductivity; EMI shielding; polymer composites

摘要：At present, dual-functional polymer composites possessing excellent thermal conductivity and high electromagnetic interference shielding effectiveness (EMI SE) are largely demanded in the synchronous thermal and EM wave management of advanced microelectronic devices. Herein, we report an annealed 3D expanded graphite (A-3D-EG) framework featuring high-quality continuous carbon architectures that can serve as high-throughput phonon and electron transmission pathways to effectively elevate the thermal conductivity and EMI shielding performance of polymers. This framework is fabricated via hydrothermally treating the aqueous slurry containing EG and GO fillers, followed by freezing-drying and annealing treatment at 1600 degrees C for 2 h. As a result, the polydimethylsiloxane composite filled with A-3D-EG reveals an outstanding thermal conductivity of 12.95 Wm(-1)K(-1) and a high EMI SE of 85.0 dB at a low filler content of 31.9 wt %. This work demonstrates that A-3D-EG has enormous utilization potential in fabricating polymer composites simultaneously with high thermal conductivity and outstanding EMI shielding capability, which can be utilized in aerospace, telecommunications, and mobile electronic devices.