详细信息
Highly aligned and densified carbon nanotube films with superior thermal conductivity and mechanical strength ( SCI-EXPANDED收录 EI收录)
文献类型:期刊文献
英文题名:Highly aligned and densified carbon nanotube films with superior thermal conductivity and mechanical strength
作者:Zhan, Hang[1];Chen, Yu Wen[1];Shi, Qiang Qiang[1];Zhang, Yu[1];Mo, Run Wei[1];Wang, Jian Nong[1]
机构:[1]East China Univ Sci & Technol, Sch Mech & Power Engn, 130 Meilong Rd, Shanghai 200237, Peoples R China
年份:2022
卷号:186
起止页码:205
外文期刊名:CARBON
收录:;EI(收录号:20214211020713);WOS:【SCI-EXPANDED(收录号:WOS:000708677300008)】;
基金:This research was supported by National Key R&D Program of China [2018YFA0208404], National Natural Science Foundation of China [52172089], and Innovation Program of Shanghai Municipal Education Commission.
语种:英文
外文关键词:Carbon nanotube film; Thermal conductivity; Mechanical strength; Alignment; Density
摘要:Flexible thermal conducting materials with the combination of excellent thermal conductivity and mechanical strength are highly desired for many practical applications, but meeting this strict requirement remains as a big challenge. Herein, facile preparation of highly aligned carbon nanotube (CNT) films is demonstrated, which involves the continuous production of a hollow cylindrical CNT assembly, followed by in-situ alignment of CNTs through optimizing the winding rate and a further stretching pressing process. Benefiting from the resultant excellent CNT alignment and high density (1.59 +/- 0.05 g cm(-3)), the CNT film simultaneously has a high thermal conductivity of 558.06-700.15 W m(-1) K-1, electrical conductivity of 4870 +/- 150 S cm(-1), mechanical strength of 2.74-2.95 GPa, and Young's modulus of 55.2-58.9 GPa. The combination of such high thermal and mechanical properties is outstanding for carbon-based thermal conducting materials. Furthermore, the CNT material exhibits negligible structural and mechanical decay even after 500 cycles of bending test. Our study provides an effective strategy toward developing new thermal conducting materials for applications under harsh conditions. (C) 2021 Elsevier Ltd. All rights reserved.
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