详细信息

中空球形组装体强化Cu0/Cu+界面促进CO2电催化还原为C2+产物  ( SCI-EXPANDED收录 EI收录)  

Shaping hollow spherical assemblies for enhanced Cu0/Cu+ interface to boost C2+ selectivity in CO2 electroreduction

文献类型:期刊文献

中文题名:中空球形组装体强化Cu0/Cu+界面促进CO2电催化还原为C2+产物

英文题名:Shaping hollow spherical assemblies for enhanced Cu0/Cu+ interface to boost C2+ selectivity in CO2 electroreduction

作者:Li, Yu[1];Shi, Haojun[2];Li, Congcong[1];Liu, Zhongliang[1];Tang, Weizheng[1];Zhang, Tingting[1];Yin, Shixin[1];Li, Huihui[1];Li, Chunzhong[1,2]

机构:[1]East China Univ Sci & Technol, Sch Chem Engn, Key Lab Ultrafine Mat, Minist Educ, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Shanghai Engn Res Ctr Hierarch Nanomat, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

年份:2024

卷号:67

期号:11

起止页码:3596

外文期刊名:SCIENCE CHINA-MATERIALS

收录:;EI(收录号:20243917092879);WOS:【SCI-EXPANDED(收录号:WOS:001318055600007)】;

基金:This work was supported by the National Natural Science Foundation of China (21838003, 21771170, 22008069), the Shanghai Municipal Science and Technology Major Project, the Fundamental Research Funds for the Central Universities (JKD01241702), and the Shanghai Rising-Star Program (20QA1402700).

语种:中文

外文关键词:Cu-0/Cu+ interface; hollow spherical assemblies; confinement effect; C-C coupling

摘要:The creation of Cu-0/Cu+ interface over Cu-based catalysts is known to facilitate the production of multi-carbon (C2+) products during CO2 reduction reaction (CO2 RR). However, the Cu+ moieties exhibit high susceptibility towards reduction into Cu-0 at a high current density. Thus, a comprehensive understanding and rational shaping strategy for the construction and stabilization of Cu-0/Cu+ interface in Cu-based catalysts is imperative. Herein, we proposed a controllable "nanoparticle assembly" strategy to obtain hollow spherical assemblies (HSA) composed of numerous Cu2O nanoparticles (HSA-Cu2O). The HSA-Cu2O catalysts significantly enhance the selectivity of C2+ products, resulting in an impressive overall Faraday efficiency (FE) of 79.2% +/- 0.7% at a partial current density of 317.1 mA cm(-2). The HSA-Cu2O catalysts undergo in-situ electrochemically reconstruction during CO2RR, achieving Cu-0/Cu+ interfacial sites with a high density. The Auger electron spectra, in-situ Raman, and morphological evolution studies have confirmed that the combination of the Cu-0/Cu+ interface and hollow sphere architecture facilitated the concentration of *CO intermediates, thereby promoting C-C dimerization to boost C2+ selectivity in CO2RR.

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