文献类型：期刊文献

英文题名：The Micro-Nano Hybrid Filler Al2O3@CuNPs Is Used to Improve the Thermal Conductivity of Epoxy Resin Composites

作者：Lu, Zijian[1];Wu, Wei[1];Drummer, Dietmar[2];Rosel, Uta[2];Tomiak, Florian[2];Wang, Yi[1];Liu, Chao[1];Li, Shuo[1];Zhao, Xintong[1]

机构：[1]East China Univ Sci & Technol, Sino German Joint Res Ctr Adv Mat, Sch Mat Sci & Engn, Shanghai, Peoples R China;[2]Friedrich Alexander Univ Erlangen Nurnberg, Inst Polymer Technol, Erlangen, Germany

年份：2026

卷号：64

期号：6

起止页码：1518

外文期刊名：JOURNAL OF POLYMER SCIENCE

收录：;EI(收录号：20260720062874);WOS:【SCI-EXPANDED(收录号:WOS:001685942500001)】；

基金：This research was funded by the German Research Foundation (DFG) within the project DFG DR 421/41-1 "Analyse des Flie ss verhaltens warmeleitfahiger Duroplaste im Spritzgie ss verfahren."

语种：英文

外文关键词：epoxy resin; hybrid filler; micro/nano filler; thermal conductivity network; thermal pathway

摘要：In this study, a micro/nano hybrid filler comprised of Al2O3@CuNPs is synthesized through a chemical reduction method. The incorporation of Cu nanoparticles serves as a bridge, addressing the contact issues within the filler and substantially enhancing its ability to establish a thermal conductivity network. The filler loading was kept at a constant level up to 70 wt%; however, the copper amount was varied between 0 and 10 wt%. The resulting thermal conductivity of the Al2O3@CuNPs/EP composite exhibits a gradual increase with the filler content, reaching 1.06 W/mK at a total filler content of 70 wt%. This represents a remarkable growth rate of 457.9% compared to pure EP. This material holds promising potential for applications in thermal conductivity materials.