详细信息
乙炔基芳酰胺酸硅烷改进石英纤维/含硅芳炔复合材料高温界面性能 ( EI收录)
High-temperature interfacial property of quartz fiber/silicon-containing arylacetylene composites with aromatic amic acid-containing alkyne-terminated silane
文献类型:期刊文献
中文题名:乙炔基芳酰胺酸硅烷改进石英纤维/含硅芳炔复合材料高温界面性能
英文题名:High-temperature interfacial property of quartz fiber/silicon-containing arylacetylene composites with aromatic amic acid-containing alkyne-terminated silane
作者:王林靖[1];扈艳红[1];杜磊[1];杨海荟[1]
机构:[1]华东理工大学材料科学与工程学院特种功能高分子材料及相关技术教育部重点实验室,上海200237
年份:2016
卷号:33
期号:2
起止页码:287
中文期刊名:复合材料学报
外文期刊名:Acta Materiae Compositae Sinica
收录:CSTPCD;;EI(收录号:20161402199911);Scopus;北大核心:【北大核心2014】;CSCD:【CSCD2015_2016】;
基金:特种功能高分子材料及相关技术教育部重点实验室(B类)开放基金上海市重点学科(B502)
语种:中文
中文关键词:石英纤维;含硅芳炔;乙炔基芳酰胺酸硅烷;酰胺环;高温界面增强
外文关键词:quartz fiber; silicon-containing arylacetylene; terminal-alkyne and aromatic amic acid-containing silane; imide ring; high-temperature interfacial reinforcement
摘要:运用自主设计合成的含有端炔和芳酰胺酸结构的硅烷偶联剂(CA-K)改善石英纤维(QF)/含硅芳炔(PSA)复合材料的高温界面黏结性能。FTIR、DSC以及TGA跟踪分析表明:CA-K在PSA固化时同步发生热闭环,形成耐热的酰亚胺环结构,CA-K同时参与PSA的固化;XPS分析推断出CA-K与纤维发生化学键合;CA-K处理后QF/PSA复合材料的界面黏结强度增加,常温下层间剪切强度(ILSS)和弯曲强度分别较未处理时提高了34.7%和40.4%,在250℃时ILSS和弯曲强度的保留率分别达到82.5%和54.9%,而500℃时ILSS和弯曲强度保留率为85.1%和64.2%。
A novel silane coupling agent(CA-K),designed and synthesized by our team,which contains terminalalkyne and aromatic amic acid groups,was employed to reinforce the interfacial bonding performances of quartz fiber(QF)/silicon-containing arylacetylene(PSA)composites at high-temperature.FTIR,DSC and TGA trace analysis indicate that the imide ring structure is formed in CA-K with PSA curing process,and CA-K takes part in the curing of PSA simultaneously.XPS analysis calculates that chemical boundings form between CA-K and fiber.The interfacial bonding strength of QF/PSA composites are improved after CA-K treatment.The interlaminar shear strength(ILSS)and flexual strength are increased by 34.7%and 40.4%compared with those of unmodified at room temperature and the retention ratios of ILSS and bending strength are 82.5% and 54.9% when the temperature rises up to 250 ℃,85.1% and 64.2% when it is 500 ℃.
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