文献类型：期刊文献

英文题名：Rheology-Optimized Photosensitive Ceramic Paste Based on P(MMA-co-MAA) for High-Resolution Photolithography of Low-Temperature Co-Fired Ceramic Vias

作者：Wang, Xiaoxuan[1];Tao, Kewen[1];Liu, Xin[1];Wang, Xinyu[1];Dong, Xiaolu[1];Li, Cunxin[1];Sun, Yuanjian[1];Wang, Yiming[1];Wang, Mingwei[1];Li, Li[1];Guo, Xuhong[1]

机构：[1]East China Univ Sci & Technol, Sch Chem Engn, State Key Lab Chem Engn & Low Carbon Technol, Shanghai 200237, Peoples R China

年份：2026

卷号：8

期号：11

起止页码：8694

外文期刊名：ACS APPLIED POLYMER MATERIALS

收录：;EI(收录号：20262420906254);WOS:【SCI-EXPANDED(收录号:WOS:001776924200001)】；

基金：We gratefully thank the financial support from the National Key R&D Program of China (2023YFD1700303), the Science and Technology Innovation Program of Hunan Province (2024RC7001), and Shanghai Zenfocus Semiconductor Technology Co., Ltd.

语种：英文

外文关键词：photosensitive ceramic paste; P(MMA-co-MAA); low-temperature co-fired ceramic (LTCC); photolithography; rheology

摘要：The fabrication of through-vias in low-temperature co-fired ceramic (LTCC) substrates is limited by the poor resolution, low efficiency, and high cost of conventional laser drilling and mechanical punching. Here, a photosensitive ceramic paste (PSCP) based on a molecularly tailored poly(methyl methacrylate-co-methacrylic acid) (P(MMA-co-MAA)) prepolymer is developed through combined polymer design and rheological engineering to enable high-resolution photolithographic patterning. By optimizing the MMA/MAA molar ratio to 4:1, the photosensitive resin achieves a pattern resolution of 5.47 mu m. A P(MMA-co-MAA) content of 30 wt % provides an optimal viscoelastic balance for uniform spin-coating, while incorporation of 50 wt % ceramic solids forms a stable composite network that ensures pattern fidelity during exposure and development. As a result, vias with a minimum diameter of 31.90 mu m and steep sidewalls are obtained at a low exposure dose of 20 mJ/cm2, outperforming a commercial benchmark paste in both resolution and sidewall verticality. This work establishes a practical materials and rheology design strategy for high-resolution photolithography patterning in high-solid-loading ceramic systems, paving the way for advanced LTCC and related electronic packaging technologies.