文献类型：期刊文献

中文题名：不饱和树脂耐热性研究

英文题名：Study on the heat-resistance of unsaturated resin

作者：钱雪微[1,2];王召巴[1,2];赵霞黄锐[1,2];吕晓平[1,2];钱建华[1,2];沈浩[1,2];宋静[1,2];陈见仁[1,2]

机构：[1]华东理工大学华昌聚合物有限公司,上海200237;[2]上海防腐蚀新材料工程技术研究中心,上海200237

年份：2016

期号：4

起止页码：37

中文期刊名：热固性树脂

外文期刊名：Thermosetting Resin

收录：北大核心:【北大核心2014】；CSCD:【CSCD2015_2016】；

基金：上海市重大科技攻关项目(12dz1100401);上海工程技术研究中心能力提升项目(13DZ2280900)资助

语种：中文

中文关键词：不饱和树脂;耐热性;玻璃化转变温度;热变形温度;韧性

外文关键词：unsaturated resin;;heat resistance;;glass transition temperature;;heat distortion temperature;;toughness

摘要：采用示差扫描量热(DSC),动态机械分析(DMA)和热变形温度(HDT)试验机对双酚A环氧乙烯基酯、酚醛环氧乙烯基酯、邻苯不饱和聚酯、间苯不饱和聚酯及对苯不饱和聚酯树脂的耐热性进行了测试。结果表明,耐温性由高到低依次为:酚醛环氧乙烯基酯MFE 770≥对苯9505>双酚A环氧乙烯基酯MFE 711>间苯9405>邻苯9708。玻璃化转变区间越大,拉伸断裂伸长率越低,树脂韧性越差。同一树脂DSC中Tg的起始温度Teig高于DMA储能模量起始温度Tei及HDT,其中HDT更接近Teig。DSC中Tg的结束温度Tefg与DMA损耗因子曲线的峰值温度Tp很接近,两者相差3℃以内。比较而言Teig,Tm(g中点温度,DSC),Tei和Tp更适合作为Tg值使用。
The heat resistance of bisphenol A epoxy vinyl ester, novolac epoxy vinyl ester, phthalic unsaturated polyester,isophthalic unsaturated polyester and terephthalic unsaturated polyester resin were determined by DSC,DMA and HDT testing machine. The results showed that the heat resistance in descending order were as followed:phenolic epoxy vinyl ester MFE 770 ≥terephthalic 9505> bisphenol A epoxy vinyl ester MFE 711> isophthalic 9405> phthalic 9708. The broader the glass transition region was,the lower the tensile elongation at break was. As a consequence,the toughness of the resin was worse. For the same resin,the Tgonset temperature Teigobtained by DSC was higher than the storage modulus onset temperature Teiobtained by DMA and HDT,where HDT was closer to Teig. The Tgend temperature Tefgin DSC was very close to the peak temperature Tpof the DMA loss factor curve and the difference was less than 3 ℃. By comparison,the Teig,Tmg(medium temperature by DSC),Tei(the storage modulus extrapolated onset temperature)and Tpwere more suitable for using as the glass transition temperature.