详细信息

Impression Creep Behavior of Sn-3.5Ag-0.7Cu/Cu Brazed  ( CPCI-S收录 EI收录)  

文献类型:会议论文

英文题名:Impression Creep Behavior of Sn-3.5Ag-0.7Cu/Cu Brazed

作者:Zou, T. W.[1];Wang, W. Z.[1];Chen, Y.[1];Huang, J. B.[1]

机构:[1]E China Univ Sci & Technol, Key Lab Pressure Syst & Safety MOE, Shanghai 200237, Peoples R China

会议论文集:14th International Conference on Pressure Vessel Technology (ICPVT)

会议日期:SEP 23-26, 2015

会议地点:Chinese Pressure Vessel Inst, Shanghai, PEOPLES R CHINA

主办单位:Chinese Pressure Vessel Inst

语种:英文

外文关键词:brazed joints; impression creep; Sn-3.5Ag-0.7Cu

摘要:Brazing, as one of the major connection technology, has been widely used in different areas such as aviation, aerospace, electronics and chemical industries etc. Sometimes creep fracture can be found in the brazed joints when they are used at high temperature. The conventional characterized method for creep properties cannot be used to study the brazed joints due to their small size. The impression technology has the potential to be used to study the creep properties of brazed joints, since no special requirements are needed for the size and shape of to-be-measured materials. In this investigation, Sn-3.5Ag-0.7Cu/Cu brazed joint is created and its creep properties is measured by impression creep testing. The effect of punching stress and temperature is studied on the impressing depth, which change from 70 to 100 MPa and 80-130 degrees C, respectively. The microstructure of Sn-3.5Ag-0.7Cu/Cu is examined by Optical Microscope (OM), Scanning Electron Microscope (SEM) and Energy Dispersive Spectra (EDS). The results show that the impressing creep depth increases with the rise of temperature and punching stress. Creep resistance of the diffusion region has obvious effect on the creep resistance of the weld. The experimental results can provide the basis for the structural integrity analysis of brazed joints. (C) 2015 Published by Elsevier Ltd.

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