详细信息

Polyquaternium-2: A New Levelling Agent for Copper Electroplating from Acidic Sulphate Bath  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:Polyquaternium-2: A New Levelling Agent for Copper Electroplating from Acidic Sulphate Bath

作者:Chen, Biao[1];Wang, Anyin[1];Wu, Shengying[1];Wang, Limin[1]

机构:[1]E China Univ Sci & Technol, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份:2016

卷号:84

期号:6

起止页码:414

外文期刊名:ELECTROCHEMISTRY

收录:;EI(收录号:20162402491807);WOS:【SCI-EXPANDED(收录号:WOS:000377626400007)】;

基金:This work was financially supported by the National Nature Science Foundation of China (NSFC 20672035, 21272069), the Fundamental Research Funds for the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences. The authors gratefully thank Metrohm for providing electrochemical measurements.

语种:英文

外文关键词:Leveler; Polyquaternium-2; Copper Electrodeposition; Through-hole Electroplating

摘要:Poly[bis(2-chloroethypether-alt-1,3-bis[3-(dimethylamino)propyl]urea] (Polyquaternium-2) was employed as a leveler in the through-hole (TH) electroplating experiments from an acidic sulphate bath. The interaction between Polyquaternium-2 and copper surface was investigated using Field Emission Scanning Electronic Microscope (FE-SEM) and X-ray Photoelectron Spectra (XPS). The electrochemical behavior of Polyquaternium-2 and its interaction with other additives, such as a suppressor and an accelerator were characterized using rotating disk electrode. Polyquaternium-2 could absorb on copper surface to form an adsorption layer and inhibit the copper electro-deposition. As shown in the TH electroplating experiments, a copper deposit with uniform thickness was obtained when 0.17 mu mol/L Polyquaternium-2 was added. The addition of Polyquaternium-2 could also increase the cathodic polarization, which is attributed to the adsorption of Polyquaternium-2 on the cathode in the process of TH electroplating. The results indicate that Polyquaternium-2 is an effective leveler used for TH electroplating, having a good synergy with SPS, PEG and Cl-. (C) The Electrochemical Society of Japan, All rights reserved.

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