文献类型：期刊文献

英文题名：Overload-Resistant Flexible Strain Sensor Based on Stacked Silver Microsheets

作者：Shen, Junhao[1]; Gan, Zewen[1]; Cui, Jiajie[1]; Zuo, Shaohua[2]; Shi, Fuwen[2]; Wang, Tao[3]; Bi, Hengchang[1]; Wu, Xing[1]

机构：[1] School of Integrated Circuits, East China Normal University, In Situ Devices Center, 500 Dongchuan Road, Shanghai, China; [2] School of Physics and Electronic Science, East China Normal University, Engineering Research Center of Nanoelectronic Integration and Advanced Equipment, 500 Dongchuan Road, Shanghai, China; [3] School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai Key Laboratory of Intelligent Sensing and Detection Technology, 130 Meilong Road, Shanghai, China

年份：2025

外文期刊名：Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

收录：EI(收录号：20260720091839)

语种：英文

外文关键词：Cracks - Silver - Solid-state sensors

摘要：Reliability is essential for flexible strain sensors. However, the physical mechanism underlying the sensor suffering an overload condition remains unclear. This work fabricated strain sensors featuring multi-layer silver microsheet (AgMS) stacks using the Langmuir-Blodgett (LB) technique. Unlike conventional crack-based sensors, these sensors, after experiencing overload, maintain a consistently low resistance, thereby demonstrating outstanding overload resistance. Scanning electron microscopy (SEM) was employed to examine the microstructure of the sensing layer following cyclic overload testing, unveiling a novel strategy for enhancing overload resistance in flexible strain devices driven by the slip mechanism of the stacked microsheets. ? 2025 IEEE.