文献类型：期刊文献

英文题名：Preparation of a Polyimide Composite Filled with Corundum as a Kind of Precision Grinding Slice

作者：Si Qingsudu[1];Chen Chen[1];Xie Xianghua[2];Dong Yaming[1]

机构：[1]Shanghai Normal Univ, Dept Chem, Shanghai 200234, Peoples R China;[2]E China Univ Sci & Technol, Dept Phys, Shanghai 200237, Peoples R China

年份：2009

卷号：113

期号：5

起止页码：3033

外文期刊名：JOURNAL OF APPLIED POLYMER SCIENCE

收录：;EI(收录号：20092912189707);WOS:【SCI-EXPANDED(收录号:WOS:000267994500036)】；

语种：英文

外文关键词：polyimide; thermal properties; films; interfaces; imaging

摘要：BY using a two-step synthetic method, a novel grinding material, SiC and polyimide grinding slice, is prepared. This grinding slice can be used for mechanical planarization of hard and brittle materials, such as silicon, optical glass, advanced ceramics, specials metal, jewelry, disks etc. For observing the physical and chemical properties of the slice, scanning electron microscopy, FTIR spectroscopy, thermal gravimetric analysis, tensile strength, and elongation at break are used. All the experimental data indicate that the SiC/PI slice will be a very useful grinding material for obtaining a precision Surface. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 113: 3033-3037, 2009