文献类型：期刊文献

英文题名：Tuning size distribution of zinc borosilicate glass additives by the length of gallate molecular chain during ball milling for lowering the sintering temperature of copper paste

作者：Zhu, Jiayi[1];Li, Jiahang[1];Chen, Chunyu[1];Jia, Qingchao[1];Jiang, Qi[1];Zhang, Liangzhu[1];Zeng, Huidan[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

年份：2024

卷号：35

期号：15

外文期刊名：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录：;EI(收录号：20242316190753);WOS:【SCI-EXPANDED(收录号:WOS:001232676900002)】；

基金：No Statement Available

语种：英文

外文关键词：Additives - Borosilicate glass - Crosslinking - Milling (machining) - Particle size - Particle size analysis - Sintering - Size distribution - Zinc compounds

摘要：The urgent need for the electronic industry is to replace the expensive silver with a cheaper copper for conductive paste. However, the high sintering temperature of copper paste over 1000 degrees C restricts its practical applications. Herein, we adjust the particle size distribution of zinc borosilicate (ZBS) glass particles through gallate-assisted ball milling to lower the sintering temperature of copper paste. It was found that the particle mean size of ZBS glasses was reduced from 8.38 to 1.22 mu m by increasing the length of the gallate molecular chain from 1.25 nm to 7.26 nm. This led to a reduction in the hemispherical temperature from 845 to 820 degrees C. However, further increasing the length of the molecular chain cannot reduce the size of glass powder due to the intertwining and cross-linking between polymer chains, which worsens the ball-milling efficiency. The sintering temperature of copper paste can be reduced to 820 degrees C by using ZBS glass with particles mean size of 1.22 mu m modified with Docosyl gallate (ZBS-DG), achieving an ultra-low conductivity resistance of 3.62 m Omega/square for the dense copper film. Therefore, our work provides an efficient method for modifying the glass size for reducing the sintering temperature of conductive paste in electronic industry.