文献类型：期刊文献

英文题名：Robust Supramolecular Adhesives Based on Natural Small Molecules Through Hydrogen Bonding

作者：Lin, Hui-Yao[1];Li, Le[1];Zhang, Qi[1];Qu, Da-Hui[1];Tong, Fei[1]

机构：[1]East China Univ Sci & Technol, Inst Fine Chem, Feringa Nobel Prize Scientist Joint Res Ctr, Frontiers Sci Ctr Materiobiol & Dynam Chem,Sch Che, Shanghai, Peoples R China

年份：2025

卷号：31

期号：26

外文期刊名：CHEMISTRY-A EUROPEAN JOURNAL

收录：;EI(收录号：20251518234261);WOS:【SCI-EXPANDED(收录号:WOS:001485263600013)】；

基金：This work was supported by the National Natural Science Foundation of China (22025503, 22375063, 22220102004), Science and Technology Commission of Shanghai Municipality (24DX1400200, 23JC1401700, 22ZR1417100), the Innovation Program of Shanghai Municipal Education Commission (2023ZKZD40), the Programme of Introducing Talents of Discipline to Universities (grant no. B16017) and the Fundamental Research Funds for the Central Universities.

语种：英文

外文关键词：natural small molecules; polydisulfide network; ring-opening polymerization; supramolecular adhesive; supramolecular chemistry

摘要：The environmental persistence and widespread application of conventional polymer adhesives raise critical concerns regarding network design complexity and long-term residue accumulation. Herein, we present a water-soluble supramolecular adhesive synthesized from natural small molecules. Unlike traditional polymer networks relying on weak intermolecular forces, this system establishes a robust ordered architecture through dynamic disulfide bond ring-opening polymerization and carboxylate ion electrostatic interactions. Water-soluble hexamethylenetetramine (HMTA) strategically increases hydrogen-bonding site density while stabilizing the network topology, efficiently reducing chain entanglement. These synergistic effects endow the material with strong adhesion capability even at minimal usage (similar to 0.4 mg/cm2), achieving a maximum adhesion strength capable of supporting up to 107 times its weight while maintaining considerable resistance to various environmental factors, including thermal extremes (-80 degrees C to 120 degrees C) and exposure to organic solvents. This supramolecular design paradigm offers an eco-friendly alternative to conventional polymeric adhesives.