详细信息
Droplet Evaporation on a Hydrophilic Mesh Considering Their Sunken Shapes in Holes ( SCI-EXPANDED收录 EI收录)
文献类型:期刊文献
英文题名:Droplet Evaporation on a Hydrophilic Mesh Considering Their Sunken Shapes in Holes
作者:Yang, Qiang[1];Ding, Yanliang[1];Xu, Xiao[1];Lu, Hao[1];Wang, Hualin[2,3];Liu, Honglai[2]
机构:[1]East China Univ Sci & Technol, Sch Mech & Power Engn, Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, State Key Lab Chem Engn, Meilong Rd, Shanghai 200237, Peoples R China;[3]East China Univ Sci & Technol, State Environm Protect Key Lab Environm Risk Asse, Meilong Rd, Shanghai 200237, Peoples R China
年份:2020
卷号:43
期号:1
起止页码:143
外文期刊名:CHEMICAL ENGINEERING & TECHNOLOGY
收录:;EI(收录号:20194407601037);WOS:【SCI-EXPANDED(收录号:WOS:000490796300001)】;
基金:The authors wish to express their sincere gratitude to the National Natural Science Foundation of China (51678238, 51722806, 51608325), the National Key R&D Program of China (2018YFC1802704, 2018YFC1801904), the China Postdoctoral Science Foundation (funded project 2018M641942), and the Shanghai Sailing Program (19YF1411800) for financial support.
语种:英文
外文关键词:Droplet evaporation; Droplet shape; Hydrophilic mesh; Mass transfer
摘要:The evolution of droplet shapes on a hydrophilic copper mesh was studied by using high-speed microscopic imaging technology. When a water droplet wets a hydrophilic mesh, the liquid-vapor interface initially adopts a convex shape, named as the "first darkness". Then, as the water evaporates, the liquid-vapor interface flattens, and then it gradually adopts a concave shape; meanwhile, a "second darkness" forms. Taking the shapes of droplets sunken in holes into consideration, the quantitative liquid-vapor interface area was acquired. The evaporation coefficient becomes lower and more reasonable when considering the area increase due to the pentahedron sunken liquid in the holes. A speculation was employed to understand the observed evaporation behavior and the overprediction of the evaporation coefficient.
参考文献:
正在载入数据...
