详细信息
Borazine-containing arylacetylene resin as low dielectric constant materials ( SCI-EXPANDED收录 EI收录)
文献类型:期刊文献
英文题名:Borazine-containing arylacetylene resin as low dielectric constant materials
作者:Guo, Kangkang[1];Qi, Huimin[1];Wang, Fan[1];Zliu, Yaping[1]
机构:[1]E China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Special Funct Polymer Mat & Related Techn, Minist Educ, Shanghai 200237, Peoples R China
年份:2014
卷号:186
期号:1
起止页码:7
外文期刊名:MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
收录:;EI(收录号:20141417545339);WOS:【SCI-EXPANDED(收录号:WOS:000337648100002)】;
基金:This work was supported by National Natural Science Foundation of China (Grant No. 90816021).
语种:英文
外文关键词:Borazine; Low dielectric constant; Arylacetylene
摘要:A novel borazine-containing arylacetylene resin (PBZA) has been synthesized in high yield through condensation reaction between B,B',B"-trichloroborazine and arylacetylene Grignard reagent, which are potential candidates as low dielectric constant material for microelectronic packaging and also radio and microwave frequency substrate. The PBZA is a brown viscous liquid and soluble in a variety of common solvents. PBZA could be cured by polymerization of alkynyl groups to form organic-inorganic hybrid structure containing borazine ring and aromatic rings with exothermic polymerization temperature in the 190-250 degrees C range and the structure exhibits great dependence on the substituent on borazine in PBZA. The cured PBZA exhibits high thermal stability with char yield up to nearly 80% at 1000 degrees C and great chemical stability. Especially, the cured PBZA shows low dielectric constant (ca. 2.7) and extremely low dielectric loss (<0.002). The cured PBZA under higer annealing temperatures exhibits lower dielectric constant and dielectric loss. (C) 2014 Elsevier B.V. All rights reserved.
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