文献类型：期刊文献

英文题名：Synthesis and application of isoindigo quaternary ammonium salts in copper plating

作者：Shan, Ruiqi[1,2];Qian, Chenhao[1,2];Li, Xuyang[1,2];Chen, Xin[1,2];Wang, Limin[1,2]

机构：[1]East China Univ Sci & Technol, Sch Chem & Mol Engn, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Inst Fine Chem, Sch Chem & Mol Engn, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2025

卷号：13

期号：40

起止页码：20715

外文期刊名：JOURNAL OF MATERIALS CHEMISTRY C

收录：;EI(收录号：20254219332921);WOS:【SCI-EXPANDED(收录号:WOS:001571853000001)】；

基金：This research was financially supported by the Sinopec Seeding Program (ZC0607-0869) and the National Natural Science Foundation of China (21772039 and 21272069), and the authors gratefully acknowledge financial support from the Central Universities and Science and Technology Commission of Shanghai Municipality (21DZ2305000). Support from the Fundamental Research Funds for the Central Universities (SLA13223001) is also acknowledged.

语种：英文

外文关键词：Additives - Copper - Copper deposits - Electrodeposition - Electrodes - Molecular dynamics - Printed circuit boards - Synthesis (chemical)

摘要：Achieving uniform through-hole filling by copper electrodeposition is important for the fabrication of printed circuit boards (PCBs), and the development of suitable additives is a key process to realize efficient electrodeposition. Five isoindigo (IID) quaternary ammonium salts were synthesized using isoindigo molecules as the core skeleton. Electrochemical tests, theoretical calculations, and molecular dynamics simulations demonstrated that the isoindigo derivatives have the ability to act as leveler and exhibit electrode absorption capacity, among which IID-C4-QL showed the best inhibition of copper deposition as well as the best cathodic adsorption ability. The high through-hole filling and excellent leveling performance of IID-C4-QL were confirmed by actual electroplating tests.