文献类型：期刊文献

中文题名：Ni-W-P镀层的防垢性能

英文题名：Antiscaling property investigation on electroless Ni-W-P composite coating

作者：王跃峰[1];侯峰[1];徐宏[1];夏翔鸣[1];曾斌[1]

机构：[1]华东理工大学机械与动力工程学院化学工程联合国家重点实验室,上海200237

年份：2011

卷号：30

期号：11

起止页码：2558

中文期刊名：化工进展

外文期刊名：Chemical Industry and Engineering Progress

收录：CSTPCD;;Scopus;北大核心:【北大核心2008】；CSCD:【CSCD2011_2012】；

语种：中文

中文关键词：化学镀;表面自由能;防垢

外文关键词：electroless coating; surface free energy; antiscaling

摘要：在紫铜基体上制备了化学镀Ni-W-P镀层,X射线衍射结果表明,镀层的结构形态为非晶态。污垢附着实验和池沸腾实验结果表明,低表面自由能的化学镀Ni-W-P镀层使污垢沉积速度降低了52%,在硫酸钙溶液中的传热系数则是紫铜表面的1.7倍。用高速摄影仪观察了沸腾表面的气泡行为,由于传热方式的差别形成了两种不同结构的硫酸钙污垢,紫铜表面为针状垢,而镀层表面是粒状垢。
A piece of electroless Ni-W-P composite coating was prepared on copper substrates.X-ray diffraction results show the coating has an amorphous structure.The results of adhesion test and pool boiling experiment all indicate that the scale adhesion speed on the electroless Ni-W-P coating with lower surface free energy is reduced by 52%,the average value of heat transfer coefficient is 1.7 times that of plain copper surface when boiling in calcium sulphate solution.The bubble behavior on boiling surface was captured by a high speed camera.Depending on the heat transfer mechanism,two different types of deposits have been observed.A needle-like structure is the characteristic of scale formed on a plain copper surface,while a granular structure corresponds to the scale formed on the Ni–W–P coating surface.