文献类型：期刊文献

中文题名：甲基三苯乙炔基硅烷树脂的固化行为及其耐热性能

英文题名：Curing Behavior and Thermal Property of Methyl-tri(phenylethynyl)silane Resin

作者：周权[1];冯霞[1];赵寒青[1];倪礼忠[1];陈建定[1]

机构：[1]华东理工大学材料科学与工程学院,上海200237

年份：2007

卷号：20

期号：1

起止页码：97

中文期刊名：功能高分子学报

外文期刊名：Journal of Functional Polymers

收录：CSTPCD;;北大核心:【北大核心2004】；CSCD:【CSCD2011_2012】；

语种：中文

中文关键词：甲基三苯乙炔基硅烷;固化动力学;耐高温;内乙炔基聚合物;多烯结构

外文关键词：methyl-tri （phenylethynyl） silane; cure kinetics; heat-resistant ; secondary acetylenic polymer; polyene structure

摘要：甲基三苯乙炔基硅烷树脂(MTPES)通过自由基机理,热聚合形成交联网络结构。TGA结果表明:氮气中树脂失重5%的温度(Td5)和800℃的质量保留率分别为695℃、92.9%,而两者在空气中却有较大幅度的下降,分别只有565℃和43.9%,聚合物表现出优异的耐热性能。通过FT-IR、DSC和流变性能研究了MTPES树脂的固化特性。利用动态DSC分析方法,采用Kissinger和Ozawa方法计算得到固化反应表观活化能分别为146.61、49.3 kJ/mol。固化反应遵循一级反应机理。
Methyl-tri （phenylethynyl）silane resin thermally polymerizes through a free-radical mechanism to a highly crosslinked network structure. The resin exhibits extremely high heat-resistance. TGA curve showed the temperature of 5 % mass loss （Tas） at 695 ℃, and total mass loss at 800 ℃ is 7.1% in nitrogen. However, both Td5 and mass loss at 800 ℃ are 565 ℃ and 56.1% in air, much lower than that in nitrogen. The polymerization reaction was followed also by FT-IR, DSC, and theological measurement. Dynamic DSC analysis demostrated the apparent activation energy of the cure reaction was about 146.6, 149.3 kJ/mol. The cure reaction follows first-order kinetics.