文献类型：期刊文献

英文题名：Polyurethane-templated 3D BN network for enhanced thermally conductive property of epoxy composites

作者：Chen, Qiming[1];Wu, Wei[1,2];Wang, Yi[1];Liu, Chao[1];Liu, Xingrong[1];Cui, Sufei[1]

机构：[1]East China Univ Sci & Technol, Sino German Joint Res Ctr Adv Mat, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Shenzhen Res Inst, Shenzhen 518063, Peoples R China

年份：2021

卷号：235

外文期刊名：POLYMER

收录：;EI(收录号：20214111017298);WOS:【SCI-EXPANDED(收录号:WOS:000710071000006)】；

基金：This work was supported by the Chinese German Centre for the Promotion of Science via the NSFC and DFG (no. GZ1448) and National Government Guided Special Funds for Local Science and Technology Development (Shenzhen, China) (No. 2021Szvup041).

语种：英文

外文关键词：Boron nitride; Three-dimensional filler network; Thermal conductivity

摘要：Utilizing three-dimensional filler has been deem as a promising approach to improve the thermal conductivity of polymer composites. In this research, we developed a polyurethane sacrificial template technique to fabricate a novel three-dimensional porous carbon bonded BN foam (3D-CBNF), aiming to improve the thermal performance of polymers (epoxy). The as-prepared 3D-CBNF/epoxy composite exhibits a high thermal conductivity (TC) of 2.11 Wm(-1) K-1 at a relatively low BN loading of 24.7 wt%, corresponding to a TC enhancement (TCE) of 1072% compared with the pure epoxy resin. The analysis of the thermal conductivity mechanism based on EMT and Foygel models and finite element simulation indicated that the high thermal conductivity of composites was due to the efficient heat transfer pathways provided by the 3D interconnected BN network and lower interface thermal resistance in internal of it. In addition, the as-obtained composite possessed a relatively low dielectric constant (below 4.5 at 1 MHz) and a high volume electrical resistivity (beyond 10(15) Omega.cm). Overall, a novel and promising method of preparation for 3D construction with thermally conductive filler, which is designed to attain composites with high thermal conductivity, has been proposed in this work.